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Computational Fluid Dynamic Modeling and Flow Visualization of an Enclosed Wet Processing System

  • Steven T. Bay (a1), Christopher F. McConnell (a1), Huw K. Thomas (a1), Michael G. Izenson (a2) and Jayathi Murthi (a3)...

Abstract

With the goal of optimizing point-to-point etch uniformity in a continuous flow wet processing system, a comprehensive fluid dynamics study was undertaken. Aspects of this work included developing a computational, finite-element, fluid dynamic model; performing a series of empirical studies based on dye-injection with photo detection and video analysis; and observing platinumwire bubble generation with transparent wafers.

Various flow modification designs were tested including the base case of no inserted device, a stationary “spinner” insert, and a stationary “showerhead” insert. Unsteady, non-uniform, flow distribution and zones of substantial flow recirculation were observed in the case of using no flow modification device. These observations were confirmed with the computational fluid dynamic model.

Used in conjunction with the two different types of flow inserts, a new supplementary Teflon screen was designed and tested. The combined optimum configuration using this screen with an insert was then identified. Significantly enhanced point-to-point etch uniformity, with minimal recirculation and prompt fluid displacement, resulted from this design.

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References

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1. Tonti, A., “Contamination by Impurities in Chemicals During Wet Processing,” in Proceedings of the Second International Symposium on Cleaning Technology in Semiconductor Device Manufacturing, The ElectroChemical Society, p. 409, 1992.
2. Rosato, J.J., Walters, R.N., Hall, R.M., Lindquist, R.G., Spearow, R.G., and Helms, C.R., “Studies of Rinse Efficiencies in Wet Cleaning Tools,” in Proceedings of the Third International Symposium on Cleaning Technology in Semiconductor Device Manufacturing, The ElectroChemical Society, p. 94, 1993.
3. Kempka, S.N., Torczynski, J.R., Geller, A.S., Rosato, J.J., Walters, R.N., and Sibbett, S.S., “Evaluation of Overflow Wet Rinsing Efficiency,” in Conference Proceedings of MICRO '94, MICROCONTAMINATION, p. 225, 1994.
4. McConnell, C.F. and Walter, A.E., U.S. Patent No. 4 633 893 (1987), European Patent No. 0 233 184 (1988), Japanese Patent No. 1 592 557 (1988), and Korean Patent No. 028 929 (1989).

Computational Fluid Dynamic Modeling and Flow Visualization of an Enclosed Wet Processing System

  • Steven T. Bay (a1), Christopher F. McConnell (a1), Huw K. Thomas (a1), Michael G. Izenson (a2) and Jayathi Murthi (a3)...

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