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Chemical Mechanical Polishing of Interlevel Dielectrics: Models for Removal Rate and Planarity

  • S. Sivaram (a1), R. Tolles (a1), H. Bath (a1), E. Lee (a1) and R. Leggett (a1)...

Abstract

This paper reviews some of the problems limiting broad manufacturing implementation of chemical mechanical polishing (CMP) as a planarization process for interlevel dielectrics. We examine the mechanism whereby polish rates tend to decrease as the polish pad ages, and propose an explanation based on slurry transport. We review a simple theory which provides an understanding in terms of basic mechanical principles of how CMP produces its planarizing effect. Finally, we demonstrate a method capable of providing a quantitative measure of planarity.

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Chemical Mechanical Polishing of Interlevel Dielectrics: Models for Removal Rate and Planarity

  • S. Sivaram (a1), R. Tolles (a1), H. Bath (a1), E. Lee (a1) and R. Leggett (a1)...

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