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Characterization Study of Al-Plug Technology

  • H. H. Hoang (a1), F. S. Chen (a1), T. E. Turner (a1), Y. S. Lin (a1), G. A. Dixit (a1) and F. T. Liou (a1)...

Abstract

This work investigates the reliability issues associated with an aluminum sputter process, called the Al-plug process, that results in the complete filling of submicron contacts and vias of various sizes. The state-of-the-art Al-plug technology has proven its superiority over conventional processes due to its process simplicity and complete elimination of metal step-coverage problems and dielectric voiding over contacts/vias, resulting in higher reliability. Materials and electrical characterization of this metal process are presented.

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Characterization Study of Al-Plug Technology

  • H. H. Hoang (a1), F. S. Chen (a1), T. E. Turner (a1), Y. S. Lin (a1), G. A. Dixit (a1) and F. T. Liou (a1)...

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