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Characterization of Tilt Boundaries by Ultra High Resolution Electron Microscopy

Published online by Cambridge University Press:  25 February 2011

W. Krakow
Affiliation:
IBM Thomas J. Watson Research Center, Yorktown Heights, N.Y. 10598
J. T. Wetzel
Affiliation:
IBM Thomas J. Watson Research Center, Yorktown Heights, N.Y. 10598
D. A. Smith
Affiliation:
IBM Thomas J. Watson Research Center, Yorktown Heights, N.Y. 10598
G. Trafas
Affiliation:
IBM Thomas J. Watson Research Center, Yorktown Heights, N.Y. 10598
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Abstract

A high resolution electron microscope study of grain boundary structures in Au thin films has been undertaken from both a theoretical and experimental point of view. The criteria necessary to interpret images of tilt boundaries at the atomic level, which include electron optical and specimen effects, have been considered for both 200kV and the newer 400kV medium voltage microscopes. So far, the theoretical work has concentrated on two different [001] tilt bounda-ries where a resolution of 2.03Å is required to visualize bulk lattice structures on either side of the interface. Both a high angle boundary, (210) σ=5, and a low angle boundary, (910) σ=41, have been considered. Computational results using multislice dynamical diffraction and image simulations of relaxed bounda-ries viewed edge-on and with small amounts of beam and/or specimen inclina-tion have been obtained. It will be shown that some structural information concerning grain boundary dislocations can be observed at 200kV. However, many difficulties occur in the exact identification of the interface structure viewed experimentally for both [001] and [011] boundaries since the resolution required is near the performance limit of a 200kV microscope. The simulated results at 400kV indicate a considerable improvement will be realized in obtain-ing atomic structure information at the interface.

Type
Research Article
Copyright
Copyright © Materials Research Society 1985

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