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Characterization of Fluorinated Polyimide Films

Published online by Cambridge University Press:  15 February 2011

Pradnya V. Nagarkar
Affiliation:
Electronics Packaging Program and Departments of Materials Science & Engineering, Massachusetts Institute of Technology, Cambridge, MA 02139
Jiong Ping Lu
Affiliation:
Electronics Packaging Program and Departments of Chemical Engineering, Massachusetts Institute of Technology, Cambridge, MA 02139
David Volfson
Affiliation:
Electronics Packaging Program and Departments of Electronics Packaging Program and Departments of Electrical Engineering and Computer ScienceMassachusetts Institute of Technology, Cambridge, MA 02139
Klavs F. Jensen
Affiliation:
Electronics Packaging Program and Departments of Chemical Engineering, Massachusetts Institute of Technology, Cambridge, MA 02139
Stephen D. Senturia
Affiliation:
Electronics Packaging Program and Departments of Electronics Packaging Program and Departments of Electrical Engineering and Computer ScienceMassachusetts Institute of Technology, Cambridge, MA 02139
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Abstract:

X-ray photoelectron spectroscopy (XPS) and Fourier transform infrared spectroscopy (FTIR) have been used to characterize the polyimide film based on 4,4′ hexafluoro-isopropylidene -bis pthalic anhydride (HFDA) and 4,4′ -bis (4-aminophenoxy) biphenyl (APBP). Films of varying thicknesses made from diluted precursors were studied by IR and XPS. An elemental analysis and a tentative peak assignment for C 1s in XPS is presented. The HFDA-APBP thick films are stoichiometric in composition and binding energies are in good agreement with data on hexafluorodianhydride-oxydianiline (HFDA-ODA). For thinner films, certain chemical modifications were observed at high cure temperatures.

Type
Research Article
Copyright
Copyright © Materials Research Society 1992

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References

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