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Characterization of Exotic Material Heat Sinks for Laser Diode Arrays

  • Edward.F. Stephens (a1)

Abstract

Low duty cycle, high peak power, conductively cooled laser diode arrays have been manufactured for several years by a number of different vendors. Typically these packages have been limited to a few percent duty cycles due to thermal problems that develop in tight bar pitch arrays at higher duty cycles. Traditionally these packages are made from some combination of copper and BeO or Tungsten/copper and BeO. Trade-offs between thermal conductivity and CTE matching are always made when manufacturing these devices. In addition, the manufacturability of the heat sinks plays a critical role in creating a cost effective, high performance solution. In this discussion we examine several different exotic materials that have been manufactured and tested as heat sinks for laser diode arrays.

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1 Tien, T. Q., Tomm, J. W., Oudart, M., and Nagle, J., “Mechanical Strain and Defect Distributions in GaAs-based diode lasers monitored during operation”, Appl. Phys. Lett., 86, 111908 (2005).
2 Tien, T. Q., Gerhardt, A., Schwirzke-Schaaf, S., Tomm, J. W., Muntz, H., Biesenbach, J., Oudart, M., Nagle, J. and Biermann, M. L., “Relaxation of packaging-induced styrains in AlGaAs-based high-power diode arrays”, Appl. Phys. Lett., 86, 101911 (2005).
3 Hwang, J. S., Modern Solder Technology for Competitive Electronics Manufacturing, (McGraw-Hill, 1996), p 75.

Characterization of Exotic Material Heat Sinks for Laser Diode Arrays

  • Edward.F. Stephens (a1)

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