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Characterization and Integration in Cu Damascene Structures of AURORA, an Inorganic Low-k Dielectric

  • R. A. Donaton (a1), B. Coenegrachts (a1), E. Sleeckx (a1), M. Schaekers (a1), G. Sophie (a2), N. Matsuki (a2), M. R. Baklanov (a1), H. Struyf (a1), M. Lepage (a1), S. Vanhaelemeersch (a1), G. Beyer (a1), M. Stucchi (a1), D. De Roest (a1) and K. Maex (a3)...

Abstract

AURORA films, which have a Si-O-Si network with –CH3 terminations, were characterized and integrated into Cu single damascene structures. The relatively low carbon concentration (∼ 20%) and the very small pore size (∼ 0.6 nm) found could be advantageous during integration of AURORA. Integration of AURORA into Cu single damascene structures was successfully achieved. Suitable resist strip processes, which are critical for Si-O-C type materials, were developed, resulting in trenches with satisfactory profiles. After a complete single damascene process, a interline dielectric constant value of 2.7 was found for line spacing down to 0.25 µm.

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[1] Russel, S.W., McKerrow, A.J., Shih, W.-Y., Singh, A., List, R.S., Ralston, A.R.K., Lee, W.W., Newton, K.J., Chang, M.-C., and Havemann, R.H., Proc. ULSI XIII, 1998, pp.289300.
[2] MRS Bulletin 22, Oct 1997.
[3] Peters, L., Semiconductor International 22, 1999, pp.5664.
[4] Matsuki, N., Matsunoshita, A., Lee, J.S., Morisada, Y., Naito, Y., and Merritt, C., 2000 Proceedings Sixth International Dielectrics for ULSI Multilevel Interconnection Conference (DUMIC), pp. 151 to 160.
[5] Loboda, M. J., Seifferly, J.A., Schneider, R.F., and Grove, C.M., Proceedings of the Symposia on Electrochemical Processing in ULSI Fabrication I and Interconnect and Contact Metallization: Materials, Processes, and Reliability. Electrochem. Soc, Pennington, NJ, USA; 1999; viii+274 pp. 145–52.
[6] Baklanov, M.R., Mogilnikov, K.P., Polovinkin, V.G., and Dultsev, F.N., J. Vac. Sci. Technol. B 18(3), May/June 2000.
[7] Baklanov, M.R. and Mogilnikov, K.P, to be published in Mat. Res. Soc. Symp. Proc., Symposium D: “Materials, Technology, and Reliability for Advanced Interconnects and Low-k Dielectrics”, 2000 MRS Spring Meeting.

Characterization and Integration in Cu Damascene Structures of AURORA, an Inorganic Low-k Dielectric

  • R. A. Donaton (a1), B. Coenegrachts (a1), E. Sleeckx (a1), M. Schaekers (a1), G. Sophie (a2), N. Matsuki (a2), M. R. Baklanov (a1), H. Struyf (a1), M. Lepage (a1), S. Vanhaelemeersch (a1), G. Beyer (a1), M. Stucchi (a1), D. De Roest (a1) and K. Maex (a3)...

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