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Bond-Angle Variation and Microstructure in Hydrogenated Amorphous Silicon

  • A. J. M. Berntsen (a1), M. J. Van Den Boogaard (a1), W. G. J. H. M. Van Sark (a1) and W. F. Van Der Weg (a1)

Abstract

A series of hydrogenated amorphous silicon (a-Si:H) films was deposited by rf glow-discharge deposition using various processing conditions. We have studied microstructure in the films by means of infrared absorption spectroscopy. Small-angle X-ray scattering measurements were used to determine the microvoid fractions of a few selected samples. Our results show that both the void fraction and the amount of microstructure can be varied either by changing the substrate temperature or by H2 dilution. Bond-angle variation in the films was probed by Raman scattering measurements. The Raman data indicate that the substrate temperature is the main variable that determines the bond-angle variation. We conclude that the presence of microvoids in a-Si:H does not influence the structural disorder of the amorphous matrix surrounding the voids. Our results are in agreement with experimental work on microvoids in a-Si1-xCx:H, and model calculations on voids in a-Si.

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Bond-Angle Variation and Microstructure in Hydrogenated Amorphous Silicon

  • A. J. M. Berntsen (a1), M. J. Van Den Boogaard (a1), W. G. J. H. M. Van Sark (a1) and W. F. Van Der Weg (a1)

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