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BCB Based Packaging for Low Actuation Voltage RF MEMS Devices

Published online by Cambridge University Press:  26 February 2011

David Peyrou ,
Fabienne PENNEC ,
Hikmat Achkar ,
Patrick PONS ,
Fabio Coccetti ,
Hervé Aubert  and
Robert Plana
David Peyrou
Affiliation:
dpeyrou@laas.fr, LAAS-CNRS, Toulouse, 31077, France
Fabienne PENNEC
Affiliation:
fpennec@laas.fr, LAAS-CNRS, Toulouse, 31077, France
Hikmat Achkar
Affiliation:
hachkar@laas.fr, LAAS-CNRS, Toulouse, 31077, France
Patrick PONS
Affiliation:
ppons@laas.fr, LAAS-CNRS, Toulouse, 31077, France
Fabio Coccetti
Affiliation:
fcoccett@laas.fr, LAAS-CNRS, Toulouse, 31077, France
Hervé Aubert
Affiliation:
haubert@laas.fr, LAAS-CNRS, Toulouse, 31077, France
Robert Plana
Affiliation:
plana@laas.fr, LAAS-CNRS, Toulouse, 31077, France
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Abstract

This paper outlines the issues related to RF MEMS packaging and low actuation voltage. It is presented an original approach concerning the modeling of the capacitive contact using multi-physics simulation and advanced characterization. A similar approach is used concerning the packaging development where multi-physic simulations are used to optimize the process. A devoted package architecture is proposed featuring very low loss at microwave range.

Keywords

microelectro-mechanical (MEMS)packagingsimulation
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 969: Symposium W – Heterogeneous Integration of Materials for Passive Components and Smart Systems , 2006 , 0969-W05-06
Copyright
Copyright © Materials Research Society 2007

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References

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