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BCB Based Packaging for Low Actuation Voltage RF MEMS Devices

  • David Peyrou (a1), Fabienne PENNEC (a2), Hikmat Achkar (a3), Patrick PONS (a4), Fabio Coccetti (a5), Hervé Aubert (a6) and Robert Plana (a7)...

Abstract

This paper outlines the issues related to RF MEMS packaging and low actuation voltage. It is presented an original approach concerning the modeling of the capacitive contact using multi-physics simulation and advanced characterization. A similar approach is used concerning the packaging development where multi-physic simulations are used to optimize the process. A devoted package architecture is proposed featuring very low loss at microwave range.

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References

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1. Rebeiz, G.M., Muldavin, J.B., “RF MEMS switches and switch circuits”, IEEE Microwave magazine, pp. 5971, Dec. 2001.
2. Mellé, S., De Conto, D., Dubuc, D., Grenier, K., Vendier, O., Muraro, J.L., Cazaux, J.L., Plana, R., “Reliability Modeling of capacitive RF-MEMS”, IEEE Transactions on Microwave Theory and Techniques, Vol.53, N°11, pp.34823488. Nov. 2005.
3. Yuan, X., Peng, Z., Wang, J.C.M., Forehand, D., Goldsmith, C.Acceleration of dielectric charging in RF MEMS capacitive switchesIEEE Transactions on device and materials reliability, vol.6, n°4, December 2006, pp 556563.
4. Reid, J.R. and Webster, R.T. “Measurements of charging in capacitive microelectromechanical switches” Electron lett, vol 38, n024, pp 1544–1545, Nov 2002.
5. van Sprengen, W.M., Puers, R., Mertens, R. and De Wolf, I.A comprehensive model to predict the charging and reliability of RF MEMS switchesJ.Micromech. Microeng., vol 14, n04, pp 514521, Jan 2004.

Keywords

BCB Based Packaging for Low Actuation Voltage RF MEMS Devices

  • David Peyrou (a1), Fabienne PENNEC (a2), Hikmat Achkar (a3), Patrick PONS (a4), Fabio Coccetti (a5), Hervé Aubert (a6) and Robert Plana (a7)...

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