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Barriers For Copper Interconnections

  • S. Simon Wong (a1), Changsup Ryu (a1), Haebum Lee (a1) and Kee-Won Kwon (a1)


The integration of Cu interconnections will require sophisticated structures to prevent Cu from coming into contact with devices. The barriers for Cu also must have good adhesion with dielectric and Cu, and yield desirable microstructure of Cu. This paper discusses several critical barrier requirements and compares the properties of Ta and Ti/TiN barrier systems.



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Barriers For Copper Interconnections

  • S. Simon Wong (a1), Changsup Ryu (a1), Haebum Lee (a1) and Kee-Won Kwon (a1)


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