Skip to main content Accessibility help
×
Home

Barriers For Copper Interconnections

  • S. Simon Wong (a1), Changsup Ryu (a1), Haebum Lee (a1) and Kee-Won Kwon (a1)

Abstract

The integration of Cu interconnections will require sophisticated structures to prevent Cu from coming into contact with devices. The barriers for Cu also must have good adhesion with dielectric and Cu, and yield desirable microstructure of Cu. This paper discusses several critical barrier requirements and compares the properties of Ta and Ti/TiN barrier systems.

Copyright

References

Hide All
[1] Muller, R. S. and Kamins, T. I., in Device Electronics for Integrated Circuits, 2nd ed. (John Wiley & Sons, New York, 1986), pp. 156.
[2] Ryu, C., Loke, A. L. S., Nogami, T. and Wong, S. S., IEEE/IRPS. Proc., p. 201, (1997).
[3] Wang, S.-Q., Suthar, S., Hoeflich, C., and Burrow, B. J., J. of Appl. Phys. 73 (5), 23012321 (1993).
[4] Olowolafe, J. O., Li, J., Mayer, J. W., and Colgan, E. G., Appl. Phys. Lett. 58 (5), 469471 (1991).
[5] Kim, D.-H., Cho, S.-L., Kim, K.-B., Kim, J. J., Park, J. W., and Kim, J. J., Appl. Phys. Lett. 69 (27), 41824184 (1996).10.1063/1.116979
[6] Ono, H., Nakano, T., and Ohta, T., Appl. Phys. Lett. 64 (12), 15111513 (1994).10.1063/1.111875
[7] Holloway, K., Fryer, P. M., Cabral, C. Jr., Harper, J. M. E., Bailey, P. J., and Kelleher, K. H., J. Appl. Phys. 71 (11), 54335443 (1992).
[8] Takeyama, M., Noya, A., Sase, T., Ohta, A., and Sasaki, K., J. of Vacuum Science & Technology B (Microelectronics and Nanometer Structures) 14 (2), 674678 (1996).
[9] Kolawa, E., Chen, J. S., Reid, J. S., Pokela, P. J., and Nicolet, M.-A., J. of Appl. Phys. 70 (3), 13691373 (1991).
[10] Oku, T., uekubo, M., Kawakami, E., Nii, K., Nakano, T., Ohta, T., and Murakami, M., in 1995 IEEE VMIC Conf., pp. 182185.
[11] Lu, J. P., Hong, Q. Z., Hsu, W. Y., Dixit, G. A., Cordasco, V., Russell, S. W., Lutttner, J. D., Havemann, R. H., Magel, L. K., and Tsai, H. L., in Advanced Metallization and Interconnect Systems for ULSI Applications (Oct. 1997).
[12] Kwon, K.-W., Ryu, C., Sinclair, R., and Wong, S. S., Appl. Phys. Lett. 71 (21), 30693071 (1997).

Barriers For Copper Interconnections

  • S. Simon Wong (a1), Changsup Ryu (a1), Haebum Lee (a1) and Kee-Won Kwon (a1)

Metrics

Full text views

Total number of HTML views: 0
Total number of PDF views: 0 *
Loading metrics...

Abstract views

Total abstract views: 0 *
Loading metrics...

* Views captured on Cambridge Core between <date>. This data will be updated every 24 hours.

Usage data cannot currently be displayed