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Atomic Structure Impacts on Dielectric and Mechanical Properties of Hydrogen-Silsesquioxane During Thermal Processing

Published online by Cambridge University Press:  10 February 2011

Youfan Liu  and
Fred Dall
Youfan Liu
Affiliation:
Dow Coming Corporation, M/S CO41B1, P. O. Box 944, Midland, MI 48686.
Fred Dall
Affiliation:
Dow Coming Corporation, M/S CO41B1, P. O. Box 944, Midland, MI 48686.
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Abstract

Atomic structure impacts on the dielectric and mechanical properties of hydrogen-silsesquioxane (HSQ) were investigated to determine the sensitivity of HSQ to Si-H bond degradation during thermal processing. It was demonstrated that the dielectric properties of HSQ films are not sensitive to Si-H bond degradation up to 50 % if polar silanol or water species are not induced during thermal processing at a temperature of ≤ 450 °C. However, as the Si-H bond density is reduced, the mechanical properties are changed due to the increasingly formed Si-O-Si networks. This provides an opportunity for tuning mechanical properties per application requirements by process optimization.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 565: Symposium O – Low-Dielectric Constant Materials V , 1999 , 267
Copyright
Copyright © Materials Research Society 1999

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References

1. Liu, Y., Chung, K., Saha, C., Liou, H., Spaulding, M., Pretzer, J., Bremmer, J., Proceedings of DUMIC, 155 (1998).Google Scholar
2. Bremnmer, J., Liu, Y., Gruszynski, K., and Dall, F., Proceedings of DUMIC, 333 (1997).Google Scholar
3. Saha, C., Chung, K., Spaulding, M., Bremmer, J., Proceedings of DUMIC, 126 (1998).Google Scholar
4. Enns, J., Gillham, J., Journal of Applied Polymer Science, 28, 2831 (1983).10.1002/app.1983.070280914Google Scholar
5. Liu, Y., Bremmer, J., Gruszynski, K., and Dall, F., Proceedings of VMIC, 655 (1997).Google Scholar
6. Bums, G., Solid State Physics, Academic Press, Inc., Orlando, 1985.Google Scholar
7. Bernath, P., Spectra of Atoms and Molecules, Oxford University Press, Inc., New York, 1995.Google Scholar