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Atomic Layer Deposition of Ta2O5 Films Using Ta(OC2H5)5 and Nh3

  • Hyun-Jung Song (a1), Wonyong Koh (a2) and Sang-Won Kang (a3)

Abstract

Tantalum oxide films were grown by chemical vapor deposition using an alternating supply of tantalum pentaethoxide and ammonia. The supply of one source was followed by a purge with argon gas before introducing the other source onto the substrate in order to prevent gas-phase reactions. At substrate temperature between 250-275 °C the film growth depended only on the number of source supply cycles (0.15 nm/cycle) and did not depend on the substrate temperature nor supply time of the sources. As-deposited films were amorphous, however, were crystallized after annealing at 800 °C in oxygen atmosphere by rapid thermal process. Annealed films showed increased dielectric constant and decreased leakage current density, which were 13.3 and 6.6 μA/cm2 at 1 MV/cm, respectively, for a 15-nm-thick film after annealing at 800 °C for 10 minutes.

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  • EISSN: 1946-4274
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