Hostname: page-component-8448b6f56d-wq2xx Total loading time: 0 Render date: 2024-04-24T03:29:12.686Z Has data issue: false hasContentIssue false

Arsenic Incorporation in InP Epilayers and Arsenide/InP Heterostructures Grown by Chemical Beam Epitaxy

Published online by Cambridge University Press:  22 February 2011

V. Rossignol
Affiliation:
Laboratoire de Physique du Solide et Energie Solaire, CNRS, Parc Sophia Antipolis, 06560 Valbonne, France
A. H. Bensaoula
Affiliation:
Space Vacuum Epitaxy Center, University of Houston, Houston, TX 77204-5507
A. Freundlich
Affiliation:
Laboratoire de Physique du Solide et Energie Solaire, CNRS, Parc Sophia Antipolis, 06560 Valbonne, France
A. Bensaoula
Affiliation:
Space Vacuum Epitaxy Center, University of Houston, Houston, TX 77204-5507
G. Neu
Affiliation:
Space Vacuum Epitaxy Center, University of Houston, Houston, TX 77204-5507
Get access

Abstract

Low levels of arsenic contamination have been previously reported (∼0.01%) in CBE grown InP by different groups. The level of As incorporation in InP is usually enhanced when arsenide(InGaAs, InAsP) / InP heterostructures are grown.

In this work, optimal growth conditions to minimize the non-intentional As contamination during the growth of these heterostructures are discussed. The red shift of band-edge excitons in the low temperature photoluminescence spectra as well as the analysis of high resolution X-ray diffraction patterns of InAsP/InP multi-quantum wells suggest the presence of As in InP barriers. This contamination is consistent with the ratio of As/P partial pressure (As residual in the chamber: 10-9-10-8 Torr) and the As/P incorporation rates. We have studied the influence of the growth temperature, the group-V/III flux ratio and the growth rate on the level of the As incorporation.

Type
Research Article
Copyright
Copyright © Materials Research Society 1994

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Roth, A.P., Rao, T. Sudersene, Benzaquen, R., Lacelle, C. and Rolfe, S., I. Vac. Sci. Technol. B 11(3), 836 (1993)Google Scholar
2. Bensaoula, A., Rossignol, V., Bensaoula, A.H., and Freundlich, A., J. Vac. Sci. Technol. B 11(3), 851 (1993)Google Scholar
3. Freundlich, A., Bensaoula, A.H., and Bensaoula, A., J. Cryst. Growth 127, 246 (1993)Google Scholar
4. Benchimol, J.L., Alaoui, F., Gao, Y., Roux, G. Le, Rao, E.V.K., and Alexandre, F., J. Cryst. Growth 105, 135 (1990)Google Scholar
5. Krijn, M.P.C.M., Semicond. Sci. Technol. 6, 27 (1991)Google Scholar
6. Varshni, Y.P., Physica 34, 149 (1967)Google Scholar
7. Kawaguchi, Y., Asahi, H., and Nagai, H., in Extended Abstracts 18th Conf. on Solid State Devices and Materials, Tokyo, 619 (1986)Google Scholar
8. Morishita, Y., Maruno, S., Gotoda, M., Nomura, Y., and Ogata, H., J. Cryst. Growth 95, 176(1989)Google Scholar
9. Calawa, A.R., Appl. Phys. Lett. 38, 701 (1981)Google Scholar