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An Overview of Multichip Module Technology for low Power Applications

  • Chung W. Ho (a1) and Sharon McAfee-Hunter (a1)

Abstract

Thin-film multichip modules (i.e. MCM-D) can provide simple, low-cost packaging and interconnect options for interconnecting high-density, high-performance devices. The following is an overview of an MCM-D technology that can be implemented on top of several substrate materials. Tradeoffs will be discussed related to using different substrate materials and the corresponding implications from the assembly point of view. The MCM-D manufacturing process is reviewed and the subsequent reliability results are discussed.

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References

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Abbasi, S. et al, “The Technology and Manufacture of the VAX-9000 Multichip Unit,” Digital Technical Journal - February 1992.
Bakoglu, H.B., Circuits, Interconnections, and Packaging for VLSI, Addison-Wesley, Reading, MA, 1990.
Lassen, C.L., “Integrating Multichip Modules into Electronic Equipment,” EPS Conference Proceedings, Marlboro, MA, September 1990.
Ohsaki, T., “Electronic Packaging in the 1900's - A Perspective from Asia,” IEEE Transactions on Components, Hybrids, and Manufacturing Technology, June 1991.
Yang, J., “The Reliability Performance Evaluation of High-Density Thin Film Multichip Substrates,” unpublished Digital Equipment Corporation technical paper, April 1992

An Overview of Multichip Module Technology for low Power Applications

  • Chung W. Ho (a1) and Sharon McAfee-Hunter (a1)

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