Ionized cluster beam deposition (ICBD) technique has been used to deposit Ag films on both Si(111) and Si(100) substrates. Sizes of clusters in ionized cluster beam are found to distribute in a range of 100–600 atoms/cluster. X-ray diffraction (XRD), and α-step profile methods are used to analyze the properties of Ag films. As a comparison, Ag films deposited by conventional evaporation are also investigated. Highly textured Ag films with strong (111) orientation on Si (111) have been obtained at high accelerating voltage Va=4kV. The crystallinity and surface flatness of Ag films can be improved by ICBD at high accelerating voltages.
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