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Adhesion Assessment of Copper Thin Films

Published online by Cambridge University Press:  10 February 2011

M. D. Kriese ,
N. R. Moody  and
W. W. Gerberich
M. D. Kriese
Affiliation:
Dept of Chemical Engineering & Materials Science, University of Minnesota, Minneapolis
N. R. Moody
Affiliation:
Sandia National Laboratories, Livermore, CA
W. W. Gerberich
Affiliation:
Dept of Chemical Engineering & Materials Science, University of Minnesota, Minneapolis
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Abstract

Nano-indentation testing has been used to quantitatively assess the adhesion of thin copper films, sputtered to thicknesses of 150 nm to 1500 nm. Copper films of low residual stress were deposited via RF diode cathode sputtering onto SiO2/Si substrates. Overlayers of DC magnetron sputtered high residual stress tungsten, 850 nm thick, were additionally used to provide a driving force for delamination. All films tested exhibited buckle-driven delamination, from which the interfacial toughness was estimated to be 0.2 – 2 J/m2, which is comparable to the thermodynamic work of adhesion. The use of an overlayer requires extensions of existing models, but otherwise does not change the interfacial adhesion, allowing measurements of films that would not otherwise delaminate.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 473: Symposium J – Materials Reliability in Microelectronics VII , 1997 , 39
Copyright
Copyright © Materials Research Society 1997

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