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Surface Flatness and Interface Stability of Ni-P Film using New Electroless Plating Method with the Emulsion of Supercritical CO2

Published online by Cambridge University Press:  26 February 2011

Hiroki Uchiyama
Affiliation:
uchiyama.h.aa@m.titech.ac.jp, Tokyo Institute of Technology, Precision and Intelligence Laboratory, Nagatsuda 4259-R2-35, Midoriku, Yokohama, Kanagawa, Yokohama, 226-8503, Japan, +81-45-924-5043
Masato Sone
Affiliation:
sone.m.aa@m.titech.ac.jp, Tokyo Institute of Technology, Precision and Intelligence Laboratory, 4259 Nagatsuda, Midori-ku, Yokohama, 226-8503, Japan
Chiemi Ishiyama
Affiliation:
ishiyama.c.aa@m.titech.ac.jp, Tokyo Institute of Technology, Precision and Intelligence Laboratory, 4259 Nagatsuda, Midori-ku, Yokohama, 226-8503, Japan
Yakichi Higo
Affiliation:
yhigo@pi.titech.ac.jp, Tokyo Institute of Technology, Precision and Intelligence Laboratory, 4259 Nagatsuda, Midori-ku, Yokohama, 226-8503, Japan
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Abstract

This paper proposes a novel coating method combining supercritical fluid technology and electroless plating in a hybrid technique. The electroless plating reactions are carried out in an emulsion of supercritical carbon dioxide (sc-CO2) and an electroless plating solution with surfactants. The Ni-P film obtained by this proposed technique was a uniform and conformal film without the pinholes and nodules. The Ni-P film fabricated by our technique was smoother and more uniform than the substrate after pretreatment and the conventional electroless plating.

Type
Research Article
Copyright
Copyright © Materials Research Society 2007

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Surface Flatness and Interface Stability of Ni-P Film using New Electroless Plating Method with the Emulsion of Supercritical CO2
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Surface Flatness and Interface Stability of Ni-P Film using New Electroless Plating Method with the Emulsion of Supercritical CO2
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Surface Flatness and Interface Stability of Ni-P Film using New Electroless Plating Method with the Emulsion of Supercritical CO2
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