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Robust Printing and Dispensing Solutions with Three Sigma Volumetric Control for 21st Century Manufacturing and Packaging

Published online by Cambridge University Press:  17 March 2011

Bo Li
Affiliation:
Church Engineering Department, nScrypt Inc., 2100 N. Alafaya Trail, Suite 200, Orlando, FL, 32826
Patrick Alan Clark
Affiliation:
Church Engineering Department, nScrypt Inc., 2100 N. Alafaya Trail, Suite 200, Orlando, FL, 32826
Kenneth Hail
Affiliation:
Church Engineering Department, nScrypt Inc., 2100 N. Alafaya Trail, Suite 200, Orlando, FL, 32826
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Abstract

The trend for the electronics industry to develop more functional, smarter and more compact devices has stressed the traditional manufacturing and packaging processes including the printing/dispensing technology. The traditional printing technique (e.g. time-pressure needle dispensing, screen printing, pin transfer and jetting) each has their own disadvantages in terms of dimensionality, accuracy, repeatability, flexibility and consistency, which have become the bottle neck of the industry. Enabling tools and technologies are greatly needed for the manufacturing and packaging of highly integrated and complicated parts and assemblies. In this paper, nScrypt will present novel pumping technologies and innovative printing/dispensing solutions for 21st century manufacturing and packaging. nScrypt's novel pump and robust system can dispense with precise volume control for tens of picoliter resolution, accurately place or align within a few microns, conformably print on exaggerated surfaces of tens of centimeters, and are flexible with materials and patterns. Dispensing of micro lines, dots, three-dimensional structures and conformal printing will be presented. This process has a wide range of applications including, but not limited to, conductors, resistors, optics, adhesives, sealants, frit, solders, encapsulates, wire bonding, underfilling, flip-chip bumping and 3-D structures.

Type
Research Article
Copyright
Copyright © Materials Research Society 2007

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References

1. Chrisey, D.B., Science 289 879 (2000).CrossRefGoogle Scholar
2. Leong, K.F., Cheah, C.M., Chua, C.K., Biomaterials, 24, 23632378 (2003).CrossRefGoogle Scholar

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