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The Reliability Assessment of Flip Chip Type Solder Joints Based on the Damage Integral Approach

Published online by Cambridge University Press:  10 February 2011

Peng Su ,
Chen Zhou ,
Sven Rzepka ,
Matt Korhonen  and
Che-Yu Li
Peng Su
Affiliation:
Cornell University, Department of Materials Science and Engineering, Ithaca, NY 14853
Chen Zhou
Affiliation:
Cornell University, Department of Materials Science and Engineering, Ithaca, NY 14853
Sven Rzepka
Affiliation:
Dresden University of Technology, Department of Electrical Engineering, Dresden, Germany
Matt Korhonen
Affiliation:
Cornell University, Department of Materials Science and Engineering, Ithaca, NY 14853
Che-Yu Li
Affiliation:
Cornell University, Department of Materials Science and Engineering, Ithaca, NY 14853
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Abstract

Thermal fatigue of flip-chip solder joints between a chip and chip carrier is a serious reliability concern. Differences in the temperature and/or in the coefficients of thermal expansion between the chip and substrate lead to stresses which may result in fatigue damage and eventual failure of the interconnect. Conventionally, the solder lives have been estimated by a Coffin-Manson type relation. However, this largely empirical approach becomes inadequate when comparing thermal histories that are widely different, as in the cases of accelerated thermal cycling and power cycling. In this study, we use a damage integral approach where the fatigue damage rate is calculated based on the momentary stress and strain (estimated analytically) experienced by the solder joints. The momentary damage is then integrated over the entire loading history to yield total damage at any moment.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 516: Symposium E – Low Dielectric Constant Materials IV , January 1998 , 357
Copyright
Copyright © Materials Research Society 1998

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References

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