Skip to main content Accessibility help
×
Home
Hostname: page-component-559fc8cf4f-sbc4w Total loading time: 0.2 Render date: 2021-03-06T09:23:45.179Z Has data issue: true Feature Flags: { "shouldUseShareProductTool": true, "shouldUseHypothesis": true, "isUnsiloEnabled": true, "metricsAbstractViews": false, "figures": false, "newCiteModal": false, "newCitedByModal": true }

The Reliability Assessment of Flip Chip Type Solder Joints Based on the Damage Integral Approach

Published online by Cambridge University Press:  10 February 2011

Peng Su
Affiliation:
Cornell University, Department of Materials Science and Engineering, Ithaca, NY 14853
Chen Zhou
Affiliation:
Cornell University, Department of Materials Science and Engineering, Ithaca, NY 14853
Sven Rzepka
Affiliation:
Dresden University of Technology, Department of Electrical Engineering, Dresden, Germany
Matt Korhonen
Affiliation:
Cornell University, Department of Materials Science and Engineering, Ithaca, NY 14853
Che-Yu Li
Affiliation:
Cornell University, Department of Materials Science and Engineering, Ithaca, NY 14853
Get access

Abstract

Thermal fatigue of flip-chip solder joints between a chip and chip carrier is a serious reliability concern. Differences in the temperature and/or in the coefficients of thermal expansion between the chip and substrate lead to stresses which may result in fatigue damage and eventual failure of the interconnect. Conventionally, the solder lives have been estimated by a Coffin-Manson type relation. However, this largely empirical approach becomes inadequate when comparing thermal histories that are widely different, as in the cases of accelerated thermal cycling and power cycling. In this study, we use a damage integral approach where the fatigue damage rate is calculated based on the momentary stress and strain (estimated analytically) experienced by the solder joints. The momentary damage is then integrated over the entire loading history to yield total damage at any moment.

Type
Research Article
Copyright
Copyright © Materials Research Society 1998

Access options

Get access to the full version of this content by using one of the access options below.

References

1. Wilcox, J. R., Inelastic Deformation and Fatigue Damage in Metals at High Homologous Temperatures, PhD thesis, Cornell University (1990)Google Scholar
2. Hart, E. W., J. Eng. Materials Technol. (ASME), 98 (3), 193202 (1976)10.1115/1.3443368CrossRefGoogle Scholar
3. Subrahmanyan, R., Wilcox, J. R., and Li, C. Y., IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 12, 480491 (1989)10.1109/33.49005CrossRefGoogle Scholar
4. Edward, L. and Zhang, Y. H., Acta Metallurgica et Materialia, 42, 14131421 (1994)10.1016/0956-7151(94)90160-0CrossRefGoogle Scholar
5. Tomkins, B., Philosophical Magazine, 18, 10411066 (1968)10.1080/14786436808227524CrossRefGoogle Scholar

Full text views

Full text views reflects PDF downloads, PDFs sent to Google Drive, Dropbox and Kindle and HTML full text views.

Total number of HTML views: 0
Total number of PDF views: 3 *
View data table for this chart

* Views captured on Cambridge Core between September 2016 - 6th March 2021. This data will be updated every 24 hours.

Send article to Kindle

To send this article to your Kindle, first ensure no-reply@cambridge.org is added to your Approved Personal Document E-mail List under your Personal Document Settings on the Manage Your Content and Devices page of your Amazon account. Then enter the ‘name’ part of your Kindle email address below. Find out more about sending to your Kindle. Find out more about sending to your Kindle.

Note you can select to send to either the @free.kindle.com or @kindle.com variations. ‘@free.kindle.com’ emails are free but can only be sent to your device when it is connected to wi-fi. ‘@kindle.com’ emails can be delivered even when you are not connected to wi-fi, but note that service fees apply.

Find out more about the Kindle Personal Document Service.

The Reliability Assessment of Flip Chip Type Solder Joints Based on the Damage Integral Approach
Available formats
×

Send article to Dropbox

To send this article to your Dropbox account, please select one or more formats and confirm that you agree to abide by our usage policies. If this is the first time you use this feature, you will be asked to authorise Cambridge Core to connect with your <service> account. Find out more about sending content to Dropbox.

The Reliability Assessment of Flip Chip Type Solder Joints Based on the Damage Integral Approach
Available formats
×

Send article to Google Drive

To send this article to your Google Drive account, please select one or more formats and confirm that you agree to abide by our usage policies. If this is the first time you use this feature, you will be asked to authorise Cambridge Core to connect with your <service> account. Find out more about sending content to Google Drive.

The Reliability Assessment of Flip Chip Type Solder Joints Based on the Damage Integral Approach
Available formats
×
×

Reply to: Submit a response


Your details


Conflicting interests

Do you have any conflicting interests? *