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Photosensitive Dielectric Film Developed Using a Polymer Blend

Published online by Cambridge University Press:  15 February 2011

M. Tani ,
S. Miyahara ,
E. Horikoshi ,
K. Natori  and
T. Sato
M. Tani
Affiliation:
Fujitsu Laboratories Ltd., 10–1, Morinosato-Wakamiya, Atsugi 243–01, Japan
S. Miyahara
Affiliation:
Fujitsu Laboratories Ltd., 10–1, Morinosato-Wakamiya, Atsugi 243–01, Japan
E. Horikoshi
Affiliation:
Fujitsu Laboratories Ltd., 10–1, Morinosato-Wakamiya, Atsugi 243–01, Japan
K. Natori
Affiliation:
Fujitsu Laboratories Ltd., 10–1, Morinosato-Wakamiya, Atsugi 243–01, Japan
T. Sato
Affiliation:
Fujitsu Laboratories Ltd., 10–1, Morinosato-Wakamiya, Atsugi 243–01, Japan
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Abstract

We developed a photosensitive film using a polymer blend for use in applications that require a high density of interconnects. Our film can be used as a dielectric or a passivation layer in high density packaging technologies. We formed vias about 20 μm in diameter using our new materials.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 264: Symposium G – Electronic Packaging Materials Science VI , 1992 , 37
Copyright
Copyright © Materials Research Society 1992

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References

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