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Photosensitive Dielectric Film Developed Using a Polymer Blend

Published online by Cambridge University Press:  15 February 2011

M. Tani
Affiliation:
Fujitsu Laboratories Ltd., 10–1, Morinosato-Wakamiya, Atsugi 243–01, Japan
S. Miyahara
Affiliation:
Fujitsu Laboratories Ltd., 10–1, Morinosato-Wakamiya, Atsugi 243–01, Japan
E. Horikoshi
Affiliation:
Fujitsu Laboratories Ltd., 10–1, Morinosato-Wakamiya, Atsugi 243–01, Japan
K. Natori
Affiliation:
Fujitsu Laboratories Ltd., 10–1, Morinosato-Wakamiya, Atsugi 243–01, Japan
T. Sato
Affiliation:
Fujitsu Laboratories Ltd., 10–1, Morinosato-Wakamiya, Atsugi 243–01, Japan
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Abstract

We developed a photosensitive film using a polymer blend for use in applications that require a high density of interconnects. Our film can be used as a dielectric or a passivation layer in high density packaging technologies. We formed vias about 20 μm in diameter using our new materials.

Type
Research Article
Copyright
Copyright © Materials Research Society 1992

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References

1. Pottiger, M.T., Solid State Tech. 32(12) S1 (1989)Google Scholar
2. Satou, H., Kojima, M., Makino, D., Kikuchi, T., and Saito, T., Electronic Components Conf. 40 751 (1990)CrossRefGoogle Scholar
3. Pottiger, M.T. and Goff, D.L., Proc. Symp. Polym. Mater. Electronic Packaging High Tech. Appl. 1987 79 (1988)Google Scholar
4. Rickerl, P.G., Stephante, J.C., and Slota, P. Jr., Electronic Components Conf. 37 220 (1987)Google Scholar
5. Pottiger, M.T., Goff, D.L., and Lautenberger, W.L., Electronic Components Conf. 38 315 (1988)Google Scholar
6. Sashida, N., Takeda, T., and Tokoh, A., Proc. International Microelectronics Conf. 1990 458 (1990)Google Scholar

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