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Optimizing Stressor Film Deposition Sequence in Polish Rate Order for Best Planarization

Published online by Cambridge University Press:  23 June 2011

John H Zhang
Affiliation:
STMicroelectronics, 2070 Route 52, Hopewell Junction, NY 12533, U.S.A.
Changyong Xiao
Affiliation:
GLOBALFOUNDRIES, 2070 Route 52, Hopewell Junction, NY 12533, U.S.A.
Jay W Strane
Affiliation:
IBM Semiconductor Research and Development Center (SRDC), 2070 Route 52, Hopewell Junction, NY 12533, U.S.A.
Rajasekhar Venigalla
Affiliation:
IBM Semiconductor Research and Development Center (SRDC), 2070 Route 52, Hopewell Junction, NY 12533, U.S.A.
Laertis Economikos
Affiliation:
IBM Semiconductor Research and Development Center (SRDC), 2070 Route 52, Hopewell Junction, NY 12533, U.S.A.
Lindsey Hall
Affiliation:
STMicroelectronics, 2070 Route 52, Hopewell Junction, NY 12533, U.S.A.
Jie Chen
Affiliation:
GLOBALFOUNDRIES, 2070 Route 52, Hopewell Junction, NY 12533, U.S.A.
Derek C Stoll
Affiliation:
IBM Semiconductor Research and Development Center (SRDC), 2070 Route 52, Hopewell Junction, NY 12533, U.S.A.
Jin Wallner
Affiliation:
IBM Semiconductor Research and Development Center (SRDC), 2070 Route 52, Hopewell Junction, NY 12533, U.S.A.
Haoren Zhuang
Affiliation:
Infineon Technologies, 2070 Route 52, Hopewell Junction, NY 12533, U.S.A
Paul Ferreira
Affiliation:
STMicroelectronics, 2070 Route 52, Hopewell Junction, NY 12533, U.S.A.
Walter Kleemeier
Affiliation:
STMicroelectronics, 2070 Route 52, Hopewell Junction, NY 12533, U.S.A.
Cindy Goldberg
Affiliation:
STMicroelectronics, 2070 Route 52, Hopewell Junction, NY 12533, U.S.A.
Yongsik Moon
Affiliation:
GLOBALFOUNDRIES, 2070 Route 52, Hopewell Junction, NY 12533, U.S.A.
Connie Truong
Affiliation:
IBM Semiconductor Research and Development Center (SRDC), 2070 Route 52, Hopewell Junction, NY 12533, U.S.A.
John Sudijono
Affiliation:
GLOBALFOUNDRIES, 2070 Route 52, Hopewell Junction, NY 12533, U.S.A.
Xiaomeng Chen
Affiliation:
IBM Semiconductor Research and Development Center (SRDC), 2070 Route 52, Hopewell Junction, NY 12533, U.S.A.
Ron Sampson
Affiliation:
STMicroelectronics, 2070 Route 52, Hopewell Junction, NY 12533, U.S.A.
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Abstract

Chemical Mechanical Polish (CMP) is one of the key technologies for the development of modern high performance integrated circuits. The requirements for the CMP uniformity get extremely demanding in order to meet the litho requirements for 32nm technology node and beyond. In this paper, two kinds of orders related to the stressor films that affect the CMP uniformity are revealed. The first is the stressor films deposition order according to the CMP polish rate of each stressor film. The second is the stress gradients order that formed inside the films sitting on top of the stressors. Through the optimization of the order, we show successfully removal of couple hundreds angstroms stressor step heights within 300mm wafer range. The method developed here can also find applications in microelectromechanical systems and 3D integration circuits.

Type
Research Article
Copyright
Copyright © Materials Research Society 2011

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References

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