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Microstructural Development in Ion Beam Assisted Evaporation of Ni, Co and Fe Films
Published online by Cambridge University Press: 25 February 2011
The development of microstructure in metal films deposited by ion-assisted evaporation has been studied by transmission electron microscopy (TEM). Films of Ni, Co, and Fe of about 350 to 500 nm thickness were deposited by electron beam evaporation with concurrent argon ion bombardment during growth. Films grown at high ion/atom ratios develop compressive stress as revealed by lattice dilatation. The trends in grain size, orientation, and shape as a function of ion bombardment are documented by TEM.
- Research Article
- MRS Online Proceedings Library (OPL) , Volume 202: Symposium C – Evolution of Thin Film and Surface Microstructure , 1990 , 187
- Copyright © Materials Research Society 1991