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Low Temperature Dopant Activation Using Variable Frequency Microwave Annealing

Published online by Cambridge University Press:  01 February 2011

Terry L. Alford
Affiliation:
TA@asu.edu, Arizona State University, 1711 S Rural Rd, ERC 252, Tempe, 85281, United States
Karthik Sivaramakrishnan
Affiliation:
s.karthik@asu.edu, Arizona State University, Tempe, Arizona, United States
Anil Indluru
Affiliation:
anil.reddy@asu.edu, Arizona State University, Tempe, Arizona, United States
Iftikhar Ahmad
Affiliation:
iahmad@microcure.com, Lambda Technologies, Morrisville, North Carolina, United States
Bob Hubbard
Affiliation:
bhubbard@microcure.com, Lambda Technologies, Morrisville, North Carolina, United States
Theodore David
Affiliation:
David.Theodore@freescale.com, Freescale Semiconductor Inc, Tempe, Arizona, United States
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Abstract

Variable frequency microwaves (VFM) and rapid thermal annealing (RTA) were used to activate ion implanted dopants and re-grow implant-damaged silicon. Four-point-probe measurements were used to determine the extent of dopant activation and revealed comparable resistivities for 30 seconds of RTA annealing at 900 °C and 6-9 minutes of VFM annealing at 540 °C. Ion channeling analysis spectra revealed that microwave heating removes the Si damage that results from arsenic ion implantation to an extent comparable to RTA. Cross-section transmission electron microscopy demonstrates that the silicon lattice regains nearly all of its crystallinity after microwave processing of arsenic implanted silicon. Secondary ion mass spectroscopy reveals limited diffusion of dopants in VFM processed samples when compared to rapid thermal annealing. Our results establish that VFM is an effective means of low-temperature dopant activation in ion-implanted Si.

Type
Research Article
Copyright
Copyright © Materials Research Society 2010

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