Published online by Cambridge University Press: 10 February 2011
Anew excimer laser recrystallization method of a-Si film to increase the grain size of poly-Si film has been proposed. Excimer laser energy was locally modulated by being irradiated on stepped substrate with 500 nm deep trench on which a-Si film was deposited. Fairly large poly-Si grains (over 1 µm) were obtained due to lateral thermal gradient which resulted from the laser energy difference on the vertical wall and on the horizontal bottom plane of the trench without altering laser energy density elaborately.
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