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Interface Study of SiO2/ HfO2/SiO2 Stacks Used as InterPoly Dielectric for Future Generations of Embedded Flash Memories

Published online by Cambridge University Press:  01 February 2011

Alexandre Guiraud
Affiliation:
alexandre.guiraud@st.com, STMicroelectronics, Crolles, France
Nicolas Breil
Affiliation:
nicolas.breil@fr.ibm.com, IBM Microelectronics, Crolles, France
Mickaël Gros-Jean
Affiliation:
mickael.gros-jean@st.com, STMicroelectronics, Crolles, France
Damien Deleruyelle
Affiliation:
damien.deleruyelle@im2np.fr, IM2NP, Marseille, France
Gilles Micolau
Affiliation:
gilles.micolau@univ-cezanne.fr, IM2NP, Marseille, France
Christophe Muller
Affiliation:
christophe.muller@im2np.fr, IM2NP, Marseille, France
Nathalie Cherault
Affiliation:
nathalie.cherault@st.com, STMicroelectronics, Crolles, France
Pierre Morin
Affiliation:
pierre.morin@st.com, STMicroelectronics, Crolles, France
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Abstract

We have investigated the integration of Hf-based material as Inter Poly Dielectric in flash memories devices. Electrical measurements showed the good properties of SiO2/HfO2/SiO2 stacks. We then interested to the impact of the thermal budget on this specific stack which induces changes in the electrical properties. XPS measurements suggests those changes are due to the presence of an Hf-silicate layer at the SiO2/HfO2 interface.

Type
Research Article
Copyright
Copyright © Materials Research Society 2010

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