Skip to main content Accessibility help
×
Home

Improvement of LDI BUMP Stripping Process by Development of Room Temperature PR Stripper

Published online by Cambridge University Press:  01 February 2011

Young-Min Kang
Affiliation:
dm.kang@samsung.com, Samsung Electronics, Manufacturing Technology Team1, San#24 Nongseo-Dong,Giheung-Gu, Yongin-City, 446-711, Korea, Republic of, 82-31-209-0984
Dong Chan Bae
Affiliation:
dc1114.bae@samsung.com, Samsung Electronics, BUMP Group, San#24 Nongseo-Dong,Giheung-Gu, Young-City, 446-711, Korea, Republic of
Hyun-Joon Kim
Affiliation:
hyunjoon.kim@samsung.com, Samsung Electronics, Manufacturing Technology Team1, San#24 Nongseo-Dong,Giheung-Gu, Young-City, 446-711, Korea, Republic of
Young- Nam Kim
Affiliation:
kimyn@samsung.com, Samsung Electronics, Manufacturing Technology Team1, San#24 Nongseo-Dong,Giheung-Gu, Young-City, 446-711, Korea, Republic of
Young Ho Kim
Affiliation:
sanho502@samsung.com, Samsung Electronics, Manufacturing Technology Team1, San#24 Nongseo-Dong,Giheung-Gu, Young-City, 446-711, Korea, Republic of
Tae Sung Kim
Affiliation:
taesung.kim@samsung.com, Samsung Electronics, Manufacturing Technology Team1, San#24 Nongseo-Dong,Giheung-Gu, Young-City, 446-711, Korea, Republic of
Get access

Abstract

Bump process using gold bump led to many cleaning problems like polymer residues, metal and polyimide consumption after stripping process. First of all, stripping process of bump photoresist is one of the difficult technologies since thickness of PR pattern of bump is thicker than that of general metal line at least 100 times. We investigated the improvement of LDI BUMP stripping Process at 25 with new chemical. We found that the wettability may be improved when the additive was added to the chemical and it improves the stripping ability. It was found that new chemical was superior to commercial chemical in terms of chemical stability, removal efficiency of polymer residue and decrease in metal and polyimide consumption. Also, we could obtain removal mechanism of photoresist pattern by measured Raman equipment and enhancement of yield in mass production line of semiconductor.

Type
Research Article
Copyright
Copyright © Materials Research Society 2007

Access options

Get access to the full version of this content by using one of the access options below.

References

1 Okinaka, Y., Hoshino, M., Some Recent Topics in Gold Plating for Electronics Applications, Gold Bulletin, 31, pp3 (1998).Google Scholar
2 Noda, S., Kawase, K., Horibe, H., Kuzumoto, M., and Kataokab, T., Development of a Method for Resist Removal by Ozone with Acetic Acid Vapor, J. of the Electrochem. Soc., 152, G 73 (2005).CrossRefGoogle Scholar
3 Jong-Kai, L., Rajiv, B., Squeegee Bump Technology, IEEE Transactions on components and packaging technologies, 25, pp38 (2002).CrossRefGoogle Scholar
4 Kamal, T. and Hess, D. W., Photoresist Removal Using Low Molecular Weight Alcohols, J. of the Electro- chem. Soc., 147, pp 2749 (2000).CrossRefGoogle Scholar
5 Ojima, S., Jizaimaru, T., Omae, S. and Ohmi, T., Room Temperature Photoresist Stripper, J. Electrochem. Soc., 144, pp 4005 (1997).CrossRefGoogle Scholar

Full text views

Full text views reflects PDF downloads, PDFs sent to Google Drive, Dropbox and Kindle and HTML full text views.

Total number of HTML views: 0
Total number of PDF views: 12 *
View data table for this chart

* Views captured on Cambridge Core between September 2016 - 16th January 2021. This data will be updated every 24 hours.

Hostname: page-component-77fc7d77f9-94bw7 Total loading time: 0.189 Render date: 2021-01-16T19:20:29.159Z Query parameters: { "hasAccess": "0", "openAccess": "0", "isLogged": "0", "lang": "en" } Feature Flags last update: Sat Jan 16 2021 18:52:30 GMT+0000 (Coordinated Universal Time) Feature Flags: { "metrics": true, "metricsAbstractViews": false, "peerReview": true, "crossMark": true, "comments": true, "relatedCommentaries": true, "subject": true, "clr": true, "languageSwitch": true, "figures": false, "newCiteModal": false, "shouldUseShareProductTool": true, "shouldUseHypothesis": true, "isUnsiloEnabled": true }

Send article to Kindle

To send this article to your Kindle, first ensure no-reply@cambridge.org is added to your Approved Personal Document E-mail List under your Personal Document Settings on the Manage Your Content and Devices page of your Amazon account. Then enter the ‘name’ part of your Kindle email address below. Find out more about sending to your Kindle. Find out more about sending to your Kindle.

Note you can select to send to either the @free.kindle.com or @kindle.com variations. ‘@free.kindle.com’ emails are free but can only be sent to your device when it is connected to wi-fi. ‘@kindle.com’ emails can be delivered even when you are not connected to wi-fi, but note that service fees apply.

Find out more about the Kindle Personal Document Service.

Improvement of LDI BUMP Stripping Process by Development of Room Temperature PR Stripper
Available formats
×

Send article to Dropbox

To send this article to your Dropbox account, please select one or more formats and confirm that you agree to abide by our usage policies. If this is the first time you use this feature, you will be asked to authorise Cambridge Core to connect with your <service> account. Find out more about sending content to Dropbox.

Improvement of LDI BUMP Stripping Process by Development of Room Temperature PR Stripper
Available formats
×

Send article to Google Drive

To send this article to your Google Drive account, please select one or more formats and confirm that you agree to abide by our usage policies. If this is the first time you use this feature, you will be asked to authorise Cambridge Core to connect with your <service> account. Find out more about sending content to Google Drive.

Improvement of LDI BUMP Stripping Process by Development of Room Temperature PR Stripper
Available formats
×
×

Reply to: Submit a response


Your details


Conflicting interests

Do you have any conflicting interests? *