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Published online by Cambridge University Press: 22 February 2011
We report a highly reliable, sputtered WGe emitter contact for npn heterojunction bipolartransistors. A specific contact resistance of 7.5 × 10−7 Ω-cm2 and a transfer resistance of 4.0 × 10−2 Ωmm were obtained after 380°C, 1 min alloy. The contact was patterned by SF6 dry etching at low bias using a Au mask. This novel contact has comparable resistance to conventional AuGe-based metallization while having superior thermal stability. We have studied the dependence of contact properties on the post-deposition annealing conditions by transfer length method of electrical characterization and Auger analysis, and will also report long-term reliability results in comparison to AuGe-based metallization.
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