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Effects of Electron Beam Exposure on Poly(Arylene Ether) Dielectric Films

Published online by Cambridge University Press:  15 February 2011

J. S. Drage
Affiliation:
AlliedSignal Inc.-Advanced Microelectronic Materials, 1349 Moffett Park Drive, Sunnyvale, CA 94089
J. J. Yang
Affiliation:
AlliedSignal Inc.-Advanced Microelectronic Materials, 1349 Moffett Park Drive, Sunnyvale, CA 94089
D. K. Choi
Affiliation:
AlliedSignal Inc.-Advanced Microelectronic Materials, 1349 Moffett Park Drive, Sunnyvale, CA 94089
R. Katsanes
Affiliation:
AlliedSignal Inc.-Advanced Microelectronic Materials, 1349 Moffett Park Drive, Sunnyvale, CA 94089
K. S. Y. Lau
Affiliation:
AlliedSignal Inc.-Advanced Microelectronic Materials, 1349 Moffett Park Drive, Sunnyvale, CA 94089
S.-Q. Wang
Affiliation:
AlliedSignal Inc.-Advanced Microelectronic Materials, 1349 Moffett Park Drive, Sunnyvale, CA 94089
L. Forester
Affiliation:
AlliedSignal Inc.-Advanced Microelectronic Materials, 1349 Moffett Park Drive, Sunnyvale, CA 94089
P. E. Schilling
Affiliation:
AlliedSignal Inc.-Advanced Microelectronic Materials, 1349 Moffett Park Drive, Sunnyvale, CA 94089
M. Ross
Affiliation:
AlliedSignal Inc.-Electron Vision, 9919 Via Pasar, San Diego, CA 92126
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Abstract

This paper presents a study of the effects of electron beam (e-beam) exposure on the chemical and physical properties of FLARE™ 1.0X, a non-fluorinated member of the FLARE™ family of poly(arylene ether) dielectric coatings. Spin-coated films of this poly(arylene ether) were cured by large-area e-beam exposure, as well as by conventional thermal processing. Neither swelling nor dissolution was observed for the e-beam cured films after immersion in N-methylpyrrolidone (NMP) at 90 °C for 1 hour. The glass transition temperature (Tg) for films cured with a low e-beam dose is slightly higher than, or nearly the same as, the (Tg) for thermally-cured films (∼ 270 °C). However, the Tg for films cured with a high e-beam dose exceeds 400 °C. Dielectric constants of e-beam cured films and thermally cured films are nearly the same. FTIR spectra of FLARE™ films obtained before and after e-beam exposure suggest that e-beam curing does not induce any significant change in the chemical structure. Increased solvent resistance, higher Tg, and low dielectric constant are properties that make this e-beam cured poly(arylene ether) film an excellent candidate for interlevel dielectric integration processes.

Type
Research Article
Copyright
Copyright © Materials Research Society 1997

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References

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Effects of Electron Beam Exposure on Poly(Arylene Ether) Dielectric Films
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