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Effect of Nano-Size Silica Abrasives in Chemical Mechanical Polishing of Copper

Published online by Cambridge University Press:  15 March 2011

Su-Ho Jung
Affiliation:
Materials Science and Engineering, University of Florida, Gainesville, FL 32611
Rajiv K. Singh
Affiliation:
Materials Science and Engineering, University of Florida, Gainesville, FL 32611 Microelectronics Research Center, University of Texas, Austin, TX 78758
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Abstract

The effect of nano-size silica abrasives in chemical mechanical polishing (CMP) of copper is studied in order to reduce mechanical stresses during polishing, which may minimize defects such as surface scratches, copper peeling, dishing and erosion. In order to achieve low stress polishing of copper while maintaining removal rate efficiency, the formation of chemically modified surface layer, which can be mechanically removed by small size and low hardness abrasives, is critical. Complexing agents play an important role in the formation of a removable surface layer in the presence of the oxidizer, which is responsible for oxide formation, and the inhibitor, which passivates the surface. A new removal mechanism is proposed by correlating results of surface roughness after polishing with removal and etch rates. The effects of large silica and alumina abrasives, ranging from 200-1000 nm in diameter, are also studied to compare the different removal mechanisms.

Type
Research Article
Copyright
Copyright © Materials Research Society 2004

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References

1. Singh, R.K. and Lee, S., 8th International Proceedings, Chemical Mechanical Planarization for ULSI Interconnection Conference (CMP-IMIC), Feb. (2003) p. 128 Google Scholar
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