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Effect of in and Out of Plane Stresses During Indentation of Diamond Films on Metal Substrates

Published online by Cambridge University Press:  15 February 2011

D. F. Bahr
Affiliation:
Chemical Engineering and Materials Science, University of Minnesota, Minneapolis, MN 55455
W. W. Gerberich
Affiliation:
Chemical Engineering and Materials Science, University of Minnesota, Minneapolis, MN 55455
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Abstract

Diamond films grown on molybdenum substrates are indented with conical diamond indenters to depths more than 5 times the thickness of the film. This causes delamination and spalling of the film. The effects of variations in indenter angle and film thickness are demonstrated. Using a radius of the delaminated area to the residual contact radius, sharper indenters are shown to cause a 10 to 20% change in that ratio. For films greater than 5 μm thick, there is no apparent film thickness effect. Possibilities for this observation are cracking due to bending stresses or the interfacial crack kinking out of the interface due to a reduction in compressive stresses, leading to mixed mode loading. The strain energy release rate of the interface for an 800 nm diamond film on molybdenum is between 2.4 and 7 J/m2.

Type
Research Article
Copyright
Copyright © Materials Research Society 1997

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References

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Effect of in and Out of Plane Stresses During Indentation of Diamond Films on Metal Substrates
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