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Deformation in Thin Films Deposited on Rigid Substrates
Published online by Cambridge University Press: 22 February 2011
Abstract
Stresses and strains are always present in thin films deposited on rigid substrates. They are introduced into the films during the deposition and/or subsequent heat and chemical treatments. Since the origins of the strains (stresses) in thin films and their shapes are different from those of bulk materials, the distribution of strains supported elastically by the films is different from that of the bulk materials. The present paper reviews deformation in thin films caused by elastic strains, using illustrative data of Pb and Nb films that were deposited on Si wafers. Also, x-ray diffraction techniques to detect such local deformation are briefly reviewed.
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- Copyright © Materials Research Society 1989
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