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Defect Analyses in VLSI Devices by TEM Observation and Process Simulation
Published online by Cambridge University Press: 03 September 2012
Abstract
This paper presents several examples of defect analyses carried out in actual VLSI failure analyses and experiments, using TEM technique, process simulation and other advanced analytical tools. New TEM techniques are also described to observe a precise location which has failed.
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- Research Article
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- Copyright © Materials Research Society 1992
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