Published online by Cambridge University Press: 21 February 2011
This paper describes the preparation of silicon-based metal oxide semiconductor, MOS, devices, capacitors and field effect transistors, FETs, using deposited oxide dielectrics. A critical aspect of the device fabrication process is the way the Si-SiO2 interface is formed; e.g., either before, during, or after the oxide deposition. We have studied different methods of fabricating Si-SiO2 heterostructures, and have concluded that the implementation of independently controllable and sequential process steps for (i) interface formation, and (ii) oxide deposition consistently yields MOS devices with electrical properties that are superior to those of devices fabricated under other processing conditions which include specifically interface formation during the oxide deposition.
Full text views reflects PDF downloads, PDFs sent to Google Drive, Dropbox and Kindle and HTML full text views.