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Concurrent Design of an RTP Chamber and Advanced control system

Published online by Cambridge University Press:  15 February 2011

Paul Spence
Affiliation:
Sandia National Laboratories Livermore, CA 94551-0969
Charles Schaper
Affiliation:
Microelectronics Control and Sensing, Inc., (MCSI) 801 W. El Camino Real, M/S 331 Mountain View, CA 94040
Ahmad Kermani
Affiliation:
CVC Products, Inc. 47061 Warm Springs Blvd., Fremont, CA 94539
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Abstract

A concurrent-engineering approach is applied to the development of an axisymmetric rapidthermal- processing (RTP) reactor and its associated temperature controller. Using a detailed finite-element thermal model as a surrogate for actual hardware, we have developed and tested a multiinput multi-output (MIMO) controller. Closed-loop simulations are performed by linking the control algorithm with the finite-element code. Simulations show that good temperature uniformity is maintained on the wafer during both steady and transient conditions. A numerical study shows the effect of ramp rate, feedback gain, sensor placement, and wafer-emissivity patterns on system performance.

Type
Research Article
Copyright
Copyright © Materials Research Society 1995

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References

[1] Schaper, C., Moslehi, M., Saraswat, K., Kailath, T., Control of MMST RTP: Repeatability, Uniformity and Integration for Flexible Manufacturing, IEEE Trans. on Semicond. Manufac., 7(2), (1994), p. 202.Google Scholar
[2] Breedijk, T., Edgar, T., Trachtenberg, I., A Model Predictive Controller for Multivariable Temperature Control in Rapid Thermal Processing, Proc. of the American Control Conference, San Francisco, CA, June, (1993), p. 2980.Google Scholar
[3] Eliah, C., RTP Multivariable Temperature Controller, Proc. of the American Control Conference, Baltimore, MD, June, (1994), p.997.Google Scholar
[4] Aral, G., Merchant, T., Cole, J., Knutson, K., Jensen, K., Concurrent Engineering of an RTP Reactor: Design and Control, Proc. of the 2nd Int. Conf. on RTP, R.B., Fair and B., Lojek (eds), Monterey, CA, Sept., (1994), p. 288.Google Scholar
[5] Mason, W.E., TACO3D- A Three-Dimensional Finite Element Heat Transfer Code, Sandia National Laboratories, (1983).Google Scholar
[6] Siegal, R., Howell, J., Thermal Radiation Heat Transfer, Hemisphere Publishing, New York, NY, (1981).Google Scholar
[7] Emery, A.F., View Users Manual, Univ. of Wash., (1984).Google Scholar
[8] Spence, P., Winters, W., Kee, R., Kermani, A., The Application of Computational Simulation to Design Optimization of an Axisymmetric Rapid Thermal Processing System, Proc. of the 2nd Int. Conf. on RTP, R.B., Fair and B., Lojek (eds), Monterey, CA, Sept., (1994), p. 139.Google Scholar
[9] Kee, R., Ting, A., Spence, P., Understanding and Improving Materials Processing Through Interpreting and Manipulating Predictive Models, Proc. of the Mat. Res. Soc. Conf., Boston, MA, Nov., (1994).Google Scholar
[10] Åström, K., Wittenmark, B., Computer Controlled Systems, Prentice-Hall, Englewood Cliffs, NJ, (1984).Google Scholar
[11] Friedland, B., Control System Design - an Introduction to State-Space Methods, McGraw- Hill Book Co., New York, NY, (1986).Google Scholar
[12] Kailath, T., Linear Systems, Prentice-Hall, Englewood Cliffs, NJ, (1980).Google Scholar
[13] Vandenabeele, P., Maex, K., Round-Robin Comparison of Temperature Non-Uniformity During RTP Due to Patterned Layers, Rapid Thermal and Related Processing Techniques, Singh, R. and Moslehi, M. (eds.), SPIE Proc. 1393, Oct., (1990).Google Scholar