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Anisotropic Fracture Behavior of Electroless deposited Ni-P Amorphous Alloy Thin Films

Published online by Cambridge University Press:  17 March 2011

Kazuki Takashima ,
Akio Ogura ,
Yusuke Ichikawa  and
Yakichi Higo
Kazuki Takashima
Affiliation:
Precision and Intelligence Laboratory, Tokyo Institute of Technology, 4259, Nagatsuta, Midori-ku, Yokohama, 226-8503, JAPAN
Akio Ogura
Affiliation:
Precision and Intelligence Laboratory, Tokyo Institute of Technology, 4259, Nagatsuta, Midori-ku, Yokohama, 226-8503, JAPAN
Yusuke Ichikawa
Affiliation:
Precision and Intelligence Laboratory, Tokyo Institute of Technology, 4259, Nagatsuta, Midori-ku, Yokohama, 226-8503, JAPAN
Yakichi Higo
Affiliation:
Precision and Intelligence Laboratory, Tokyo Institute of Technology, 4259, Nagatsuta, Midori-ku, Yokohama, 226-8503, JAPAN
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Abstract

Fracture tests have been carried out for an electroless deposited Ni-P amorphous alloy thin film with different crack growth directions. Cantilever beam type specimens with dimensions of 10 × 10 × 50 μm3 were prepared from a Ni-P amorphous thin film and notches with different directions, which are perpendicular and parallel to the deposition growth direction, were introduced by focused ion beam machining. Fatigue pre-cracks were introduced ahead of the notches. Fracture tests were performed using a mechanical testing machine for micro-sized specimens. Fracture behavior is different between the two types of specimens. As K IC values were not obtained because the criteria of plane strain were not satisfied for this size of the specimen, the provisional fracture toughness K Q values were determined. The K Q value of the specimen with crack propagation direction being perpendicular to the deposition growth direction was 4.2 MPam1/2, while that with crack propagation direction being parallel to the deposition growth direction was 7.3 MPam1/2. This result suggests that the electroless deposited Ni-P amorphous alloy thin film has anisotropic fracture properties.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 657: Symposia EE – Materials Science of Microelectromechanical Systems (MEMS) Devices III , 2000 , EE5.12
Copyright
Copyright © Materials Research Society 2001

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