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3D System Integration Technologies

Published online by Cambridge University Press:  01 February 2011

Peter Ramm
Affiliation:
Fraunhofer Institute for Reliability and Microintegration, Munich Division Hansastrasse 27d, 80686 Munich, Germanypeter.ramm@izm-m.fraunhofer.de
Armin Klumpp
Affiliation:
Fraunhofer Institute for Reliability and Microintegration, Munich Division Hansastrasse 27d, 80686 Munich, Germanypeter.ramm@izm-m.fraunhofer.de
Reinhard Merkel
Affiliation:
Fraunhofer Institute for Reliability and Microintegration, Munich Division Hansastrasse 27d, 80686 Munich, Germanypeter.ramm@izm-m.fraunhofer.de
Josef Weber
Affiliation:
Fraunhofer Institute for Reliability and Microintegration, Munich Division Hansastrasse 27d, 80686 Munich, Germanypeter.ramm@izm-m.fraunhofer.de
Robert Wieland
Affiliation:
Fraunhofer Institute for Reliability and Microintegration, Munich Division Hansastrasse 27d, 80686 Munich, Germanypeter.ramm@izm-m.fraunhofer.de
Andreas Ostmann
Affiliation:
Technical University of Berlin Gustav-Meyer-Allee 25, 13355 Berlin, Germany
Jürgen Wolf
Affiliation:
Technical University of Berlin Gustav-Meyer-Allee 25, 13355 Berlin, Germany
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Abstract

In the last years strong efforts were made to miniaturize microelectronic systems. Chip scale packages, flip chips and multichip modules are now commonly used in a great variety of products (e. g. mobile phones, hand-held computers and chip cards). Future microelectronic applications require significantly more complex devices with increased functionality and performance. Due to added device content, chip area will also increase. Performance, multi-functionality and reliability of microelectronic systems will be limited mainly by the wiring between the subsystems (so called “wiring crisis”), causing a critical performance bottleneck for future IC generations. 3D System Integration provides a base to overcome these drawbacks. Furthermore, systems with minimum volume and weight as well as reduced power consumption can be realized for portable applications. 3D integrated systems show reduced chip areas and enable optimized partitioning, both which decrease the fabrication cost of the system. An additional benefit is the enabling of minimal interconnection lengths and the elimination of speed-limiting inter-chip interconnects. 3D concepts which take advantage of wafer level processing to avoid increasing package sizes and expensive single component assembling processes have the potential to integrate passive devices resistors, inductors and capacitors into the manufacturing system and provide full advantage for system performance.

The ITRS roadmap predicts an increasing demand for systems-on-a-chip (SoC) [1]. Conventional fabrication is based on embedded technologies which are cost intensive. A new low cost fabrication approach for vertical system integration is introduced. The wafer-level 3D SoC technology, optimized to the capability for chip-to-wafer stacking has the potential to replace embedded technologies based on monolithic integration.

Type
Research Article
Copyright
Copyright © Materials Research Society 2003

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