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Metalorganic Deposition (MOD): A Nonvacuum, Spin-on, Liquid-Based, Thin Film Method

  • J.V. Mantese, A.L. Micheli, A.H. Hamdi and R.W. Vest

Extract

There are many methods of depositing thin film materials: thermal evaporation, sputtering, electron or laser beam evaporation, chemical vapor deposition (CVD), and molecular beam epitaxy (MBE). A good survey of many of the deposition methods appears in the 1988 November and December issues of the MRS BULLETIN. One method not included in that survey, however, is metalorganic deposition (MOD), a powerful method for depositing a variety of materials.

Metalorganic deposition is not to be confused with metalorganic chemical vapor deposition (MOCVD), which is a gaseous deposition method. MOD is a nonvacuum, liquid-based, spin-on method of depositing thin films. A suitable organic precursor, dissolved in solution, is dispensed onto a substrate much like photoresist. The substrate is spun at a few thousand revolutions per minute, removing the excess fluid, driving off the solvent, and uniformly coating the substrate surface with an organic film a few microns thick. The soft metalorganic film is then pyrolyzed in air, oxygen, nitrogen, or other suitable atmosphere to convert the metalorganic precursors to their constituent elements, oxides, or other compounds. Figure 1 shows a schematic of the deposition process including a prebake and annealing (if necessary).

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1.Mantese, J.V., Hamdi, A.H., Micheli, A.L., Chen, Y.L., Wong, C.A., Johnson, J.L., Karmarkar, M.M., and Padmanabhan, K.R., Appl. Phys. Lett. 52 (1988) p. 1631.
2.Hamdi, A.H., Mantese, J.V., Micheli, A.L., Laugal, R.C.O., Dungan, D.F., Zhang, Z.H., and Padmanabhan, K.R., Appl. Phys. Lett. 51 (1987) p. 2152.
3.Maruyama, T. and Kitamura, K., Jpn. J. Appl. Phys. 28 (1989) p. L312.
4.Vest, G.M. and Vest, R.W., Intl. J. Hybrid Micro. 2 (1982) p. 62.
5.Sabo, C.J., Vest, G.M., Singaram, S., and Mis, D., Proc. Intl. Soc. Hybrid Micro. Symp., Nov. 11–14, Anaheim, CA 59 (1985).
6.Vest, R.W. and Xu, J., IEEE Trans. UFFC 35 (1988) p. 711.
7.Xu, J., Shaikh, A.S., and Vest, R.W., Thin Solid Films 161 (1988) p. 273.
8.Xu, J.J., Shaikh, A.S., and Vest, R.W., IEEE Trans. UFFC 36 (1989) p. 307.
9.Hamdi, A.H., Mantese, J.V., Micheli, A.L., Waldo, R.A., Chen, Y.L., Wong, C.A., Karmarkar, M.M., and Padmanabhan, K.R., J. Mater. Res. 3 (1988) p. 1311.
10.Hamdi, A.H., Mantese, J.V., Micheli, A.L., Waldo, R.A., Chen, Y.L., and Wong, C.A., Appl. Phys. Lett. 53 (1988) p. 435.
11. Strem Chemicals, Newburyport, MA.
12. Engelhard Industries, Newark, NJ.
13.Vest, G.M. and Singaram, S.,in Defect Properties and Processing of High-Technology Nonmetallic Materials, edited by Chen, Y., Kingery, W.D., and Stokes, R.J. (Mat. Res. Soc. Proc. 60, Pittsburgh, PA, 1986) p. 35.
14.Gaskell, D.R., Introduction to Metallurgical Thermodynamics, 2nd Ed. (McGraw-Hill, New York, 1981) p. 286292.
15.Matsuba, I. and Matsumota, K., IEEE Trans. on Elec. Dev. 33 (1986) p. 1263.
16.Mantese, J.V., Catalan, A.B., Hamdi, A.H., and Micheli, A.L., Appl. Phys. Lett. 52 (1988) p. 1741.
17.Harriot, L.T., Cummings, K.D., Gross, M.E., and Brown, W.L., Appl. Phys. Lett. 49 (1986) p. 1661.
18.Ohmura, Y., Shiokawa, T., Toyoda, K., and Namba, S., Appl. Phys. Lett. 51 (1987) p. 1500.
19.Mantese, J.V., Catalan, A.B., Mance, A.M., Hamdi, A.H., Micheli, A.L., Sell, J.A., and Meyer, M.S., Appl. Phys. Lett. 53 (1988) p. 1335.
20.Krauss, T., Speth, A., Oprysko, M.M., Fan, B., and Grebe, K., Appl. Phys. Lett. 53 (1988) p. 947.
21.Beeson, K.W. and Clements, N.S., Appl. Phys. Lett. 53 (1988) p. 547.
22.Gross, M.E., Appelbaum, A., and Gallagher, P.K., J. Appl. Phys. 61 (1987) p. 1628.
23.Gupta, A. and Jagannathan, R., Appl. Phys. Lett. 51 (1987) p. 2254.
24.Mantese, J.V., Catalan, A.B., Hamdi, A.H., Micheli, A.L., and Studer-Rabeler, K., Appl. Phys. Lett. 53 (1988) p. 526.
25.Craighead, H.G. and Schiavone, L.M., Appl. Phys. Lett. 48 (1986) p. 1748.
26.Serafino, A.J., Coyle, R.J.. Wolk, G.L., Doll, R.F., Semi. Int. 132 (June 1988).
27.Gross, M.E., Fisanick, G.J., Gallagher, P.K., Schnoes, K.J., and Fennell, M.D., Appl. Phys. Lett. 47 (1985) p. 923.
28.Fisanick, G.J., Gross, M.E., Hopkins, J.B., Fennell, M.D., Schnoes, K.J., and Katzir, A., J. Appl. Phys. 57 (1985) p. 1139.
29.Micheli, A.L., Chang, S., and Hicks, D.B., Ceram. Eng. Sci. Proc. 8 (1987) p. 1095.

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