Hostname: page-component-8448b6f56d-wq2xx Total loading time: 0 Render date: 2024-04-20T00:59:26.270Z Has data issue: false hasContentIssue false
  • English
  • Français

Materials Issues in Magnetic-Disk Performance

Published online by Cambridge University Press:  29 November 2013

Mary F. Doerner  and
Richard L. White
Get access

Extract

The continued exponential growth in areal density for longitudinal magnetic-recording devices places ever more stringent demands on disk performance. The design of materials and processes must provide the required advances in technology. The magnetic properties are controlled through the choice of underlayers, magnetic alloys, and the deposition processes that control crystallographic orientation and magnetic isolation between grains. The requirement of lower head-disk spacing places increasing stress on the tribological performance of the disks, controlled by a very thin overcoat and lubricant layer. This article reviews the various materials issues relevant to magnetic-disk technology.

The major obstacle for achieving high areal density in thin-film media is transition noise. This noise arises from the zig-zag transition boundaries that occur due to cooperative switching of the magnetic grains. Both exchange coupling between grains and magnetostatic interactions cause magnetic-cluster sizes larger than the grain size. The goal is to magnetically isolate the grains and keep the grain size small. As the dimensions of the bit cell shrink, smaller grain size is required to obtain enough grains per bit cell to maintain the required signal-to-noise ratio (SNR). In the 10–40-Gbits/in.2 areal-density range, the issue of thermal stability of small (<10 nm), isolated grains needs to be addressed.

In addition to good SNR, a narrow transition width is needed in order to pack the transitions closer together. The objective is to minimize interactions between transitions to reduce nonlinear amplitude loss and superlinear noise.

Type
Ultrahigh-Density Information-Storage Materials
Information
MRS Bulletin , Volume 21 , Issue 9 , September 1996 , pp. 28 - 34
Copyright
Copyright © Materials Research Society 1996

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1.Grochowski, E. and Thompson, D.A., IEEE Trans. Magn. 30 (1994) p. 3797.CrossRefGoogle Scholar
2.Baugh, R.A., Murdock, E.S., and Natarajan, B.R., IEEE Trans. Magn. 19 (1983) p. 1722.CrossRefGoogle Scholar
3.Belk, N.R., George, P.K., and Mowry, G.S., IEEE Trans. Magn. 21 (1985) p. 1350.CrossRefGoogle Scholar
4.Zhu, J.G. and Bertram, H.N., J. Appl. Phys. 63 (1988) p. 3248.CrossRefGoogle Scholar
5.Miles, J.J., Wdowin, M., Oakley, J., and Middleton, B.K., IEEE Trans. Magn. 31 (1995) p. 1013.CrossRefGoogle Scholar
6.Murdock, E., Simmons, R., and Davidson, R., IEEE Trans. Magn. 28 (1992) p. 3078.CrossRefGoogle Scholar
7.Lu, P.L. and Charap, S.H., IEEE Trans. Magn. 30 (1994) p. 4230.Google Scholar
8.Lambeth, D.N., Velu, E.M.T., Bellesis, G., Lee, L.L., and Laughlin, D.E., J. Appl. Phys. 79 (1996) p. 4496.CrossRefGoogle Scholar
9.Barndt, R.D., Armstrong, A.J., and Wolf, J.K., IEEE Trans. Magn. 29 (1993) p. 183.CrossRefGoogle Scholar
10.Matsumo, K., Shukuri, K., Nakazumi, T., and Sono, K., Jpn. Mag. Soc. 13 (1989) p. 763.Google Scholar
11.Tsai, H., Lai, B.B., and Eltouhky, A., J. Appl. Phys. 71 (1992) p. 3579.CrossRefGoogle Scholar
12.Allegranza, O.C. and Wu, T., IEEE Trans. Magn. 31 (1995) p. 2797.CrossRefGoogle Scholar
13.Mirzamaani, M., Jahnes, C.V., and Russak, M.A., IEEE Trans. Magn. 28 (1992) p. 3090.CrossRefGoogle Scholar
14.Kogure, T., Matsuno, Y., Itoh, T., and Shima, C., IEEE Trans. Magn. 30 (1994) p. 4116.CrossRefGoogle Scholar
15.Mirzamaani, M. and Doerner, M.F., Paper FA-02, presented at Intermag *96, Seattle.Google Scholar
16.Wu, E.Y., Peske, J.V., and Palmer, D., IEEE Trans. Magn. 30 (1994) p. 3996.CrossRefGoogle Scholar
17.Homola, A. and Sussner, H., U.S. Patent No. 4,542,071 (1985).Google Scholar
18.Kawai, H., Kurikawa, A., and Suzuki, H., U.S. Patent No. 5,029,315 (1991).Google Scholar
19.Ranjan, R., Lambeth, D.N., Tromel, M., Goglia, P., and Li, Y., J. Appl. Phys. 69 (1991) p. 5745.CrossRefGoogle Scholar
20.Baumgart, P., Krajnovich, D.J., Nguyen, T.A., and Tarn, A.C., IEEE Trans. Magn. 31 (1995) p. 2946.CrossRefGoogle Scholar
21.Yogi, T., Nguyen, T.A., Lambert, S.E., Gorman, G.L., and Castillo, G., IEEE Trans. Magn. 26 (1990) p. 1578.CrossRefGoogle Scholar
22.Howard, J.K., J. Appl. Phys. 63 (1988) p. 3263.CrossRefGoogle Scholar
23.Suzuki, H., Tsumita, N., Hayashi, M., Shiroishi, Y., and Matsuda, Y., IEEE Trans. Magn. 26 (1990) p. 2280.CrossRefGoogle Scholar
24.Yamashita, T., Chan, L.H., Fujiwara, T., and Chen, T., IEEE Trans. Magn. 27 (1991) p. 4727.CrossRefGoogle Scholar
25.Daval, J. and Randet, D., IEEE Trans. Magn. 6 (1970) p. 768.CrossRefGoogle Scholar
26.Hikosaka, T. and Nishikawa, R., IEEE Trans. J. Magn. Jpn. 6 (1991) p. 678.CrossRefGoogle Scholar
27.Shen, Y., Laughlin, D.E., and Lambeth, D.N., J. Appl. Phys. 76 (1994) p. 8167.CrossRefGoogle Scholar
28.Tang, L. and Thomas, G., J. Appl. Phys. 74 (1993) p. 5025.CrossRefGoogle Scholar
29.Mirzamaani, M., Jahnes, C.V., and Russak, M.A., J. Appl. Phys. 69 (1991) p. 5169.CrossRefGoogle Scholar
30.Ye, X.G. and Zhu, J.G., J. Appl. Phys. 28 (1992) p. 3087.Google Scholar
31.Ding, J. and Zhu, J.G., J. Appl. Phys. p. 3978.Google Scholar
32.Futamoto, M., Suzuki, M., Inaba, N., Nakamura, A., and Honda, Y., J. Appl. Phys. p. 3975.Google Scholar
33.Nolan, T.P., Sinclair, R., Ranjan, R., and Yamashita, T., J. Appl. Phys. 73 (1993) p. 5566.CrossRefGoogle Scholar
34.Ye, X.G. and Zhu, J.G., J. Appl. Phys. 75 (1994) p. 6135.CrossRefGoogle Scholar
35.Peng, Q., Bertram, H.N., Fussing, N., Doerner, M., Mirzamaani, M., Margulies, D., Sinclair, R., and Lambert, S., IEEE Trans. Magn. 31 (1995) p. 2821.CrossRefGoogle Scholar
36.Doerner, M.F., Wang, P.W., Mirzamaani, S.M., Parker, D.S., and Wall, A.C., in Magnetic Materials: Microstructure and Properties, edited by Suzuki, T., Sugita, Y., Clemens, B., Ouchi, K., and Laughlin, D.E. (Mater. Res. Soc. Symp. Proc. 232, Pittsburgh, 1991) p. 27.Google Scholar
37.Koga, N., Ito, S., and Tomiyasu, H., IEEE Trans. J. Magn. Jpn. 4 (1989) p. 680.CrossRefGoogle Scholar
38.Nishikawa, R., Hikosaka, T., Igarashi, K., and Kanamaru, M., IEEE Trans. Magn. 25 (1989) p. 3890.CrossRefGoogle Scholar
39.Lin, T., Alani, R., and Lambeth, D.N., J. Magn. Magn. Mater. 78 (1989) p. 213.CrossRefGoogle Scholar
40.Nolan, T.P., Sinclair, R., Ranjan, R., and Yamashita, T., J. Appl. Phys. 73 (1993) p. 5117.CrossRefGoogle Scholar
41.Kataoka, H., Bain, J.A., Brennan, S., and Clemens, B.M., J. Appl. Phys. 73 (1993) p. 7591.CrossRefGoogle Scholar
42.Johnson, K.E., Mirzamaani, M., and Doerner, M.F., IEEE Trans. Magn. 31 (1995) p. 2721.CrossRefGoogle Scholar
43.Parker, M.A., Howard, J.K., Ahlert, R., and Coffey, K.R., J. Appl. Phys. 73 (1993) p. 5560.CrossRefGoogle Scholar
44.Shiroishi, Y., Hosoe, Y., Ishikawa, A., Sugita, Y., Suzuki, H., Ohno, T., and Ohura, M., J. Appl. Phys. 73 (1993) p. 5569.CrossRefGoogle Scholar
45.Inaba, N., Nakamura, A., Yamamoto, T., Hosoe, Y., and Futamoto, M., J. Appl. Phys. 79 (1996) p. 5354.CrossRefGoogle Scholar
46.McKinlay, S., Fussing, N., Sinclair, R., and Doerner, M., Paper GC-02, presented at Intermag '96, Seattle.Google Scholar
47.Lee, L.L., Laughlin, D.E., Fang, L., and Lambeth, D.N., IEEE Trans. Magn. 31 (1995) p. 2728.Google Scholar
48.Lee, L.L., Cheong, B.K., Laughlin, D.E., and Lambeth, D.N., Appl. Phys. Lett. 67 (1995) p. 3638.CrossRefGoogle Scholar
49.Kanabe, T., Kashiwase, H., Fujita, E., Yahisa, Y., and Furusawa, K., IEEE Trans. Magn. 31 (1995) p. 2734.Google Scholar
50.Shimatsu, T., Yokota, S., Djayaprawira, D.D., Takahashi, M., and Wakiyama, T., IEEE Trans. J. Magn. Jpn. 9 (1994) p. 34.CrossRefGoogle Scholar
51.Fisher, R.D., Allan, J.C., and Pressesky, J.L., IEEE Trans. Magn. 22 (1986) p. 352.CrossRefGoogle Scholar
52.Tani, N., Takahashi, T., Hashimoto, M., Ishikawa, M., Ota, Y., and Nakamura, K., IEEE Trans. Magn. 27 (1991) p. 4736.CrossRefGoogle Scholar
53.Paik, C.R., Suzuki, I., Tani, N., Ishikawa, M., and Ota, Y., IEEE Trans. Magn. 28 (1992) p. 3084.CrossRefGoogle Scholar
54.Ishikawa, M., Tani, N., Yamada, Y., Ota, Y., Nakamura, K., and Itoh, A., IEEE Trans. Magn. 22 (1986) p. 573.CrossRefGoogle Scholar
55.Yamada, Y., Tani, N., Ishikawa, M., Ota, Y., Nakamura, K., and Itoh, A., IEEE Trans. Magn. 21 (1985) p. 1429.CrossRefGoogle Scholar
56.Howard, J.K. and Wang, R.H., U.S. Patent No. 4,789,598 (1988).Google Scholar
57.Doerner, M.F., Yogi, T., Parker, D.S., Lambert, S., Hermsmeier, B., Allegranza, O.C., and Nguyen, T., IEEE Trans. Magn. 29 (1993) p. 3667.CrossRefGoogle Scholar
58.Hono, K., Maeda, Y., Babu, S.S., and Sakurai, T., J. Appl. Phys. 76 (1994) p. 8025.CrossRefGoogle Scholar
59.Maeda, Y., Hironi, S., and Asahi, M., J. Appl. Phys. 24 (1985) p. L951.CrossRefGoogle Scholar
60.Chapman, J.N., McFadyen, I.R., and Bernards, J.P.C., J. Magn. Magn. Mater. 62 (1986) p. 359.CrossRefGoogle Scholar
61.Hono, K., Yeh, K., Maeda, Y., and Sakurai, T., Appl. Phys. Lett. 66 (1995) p. 1686.CrossRefGoogle Scholar
62.Yang, X.B., Okumura, Y., and Endo, I., J. Magn. Magn. Mater. 129 (1994) p. 378.CrossRefGoogle Scholar
63.Hwang, C.H., Park, Y.S., Jang, P.W., and Lee, T.D., IBEE Trans. Magn. 29 (1993) p. 3733.CrossRefGoogle Scholar
64.Kawanabe, T. and Naoe, M., IBEE Trans. Magn. 24 (1988) p. 2721.CrossRefGoogle Scholar
65.Shimuzu, T., Ikeda, Y., and Takayama, S., IEEE Trans. Magn. 28 (1992) p. 3102.CrossRefGoogle Scholar
66.Murayama, A., Miyamura, M., and Kondoh, S., J. Appl. Phys. 76 (1994) p. 5361.CrossRefGoogle Scholar
67.Lambert, S.E., Howard, J.K., and Sanders, I.L., IEEE Trans. Magn. 26 (1990) p. 2706.CrossRefGoogle Scholar
68.Aisenberg, S. and Chabot, R., J. Appl. Phys. 42 (1971) p. 2953.CrossRefGoogle Scholar
69.King, F.K., IEEE Trans. Magn. 17 (1981) p. 1376.CrossRefGoogle Scholar
70.Robertson, J., Prog. Solid State Chem. 21 (1991) p. 199.CrossRefGoogle Scholar
71.Angus, J.C., Wang, W., and Sunkara, M., Annu. Rev. Mater. Sci. 21 (1991) p. 221.CrossRefGoogle Scholar
72.Howard, J.K., U.S. Patent No. 4,778,582 (Oct. 18, 1988).Google Scholar
73.Zelez, J., J. Vac. Sci. Technol. 1 (1983) p. 305.CrossRefGoogle Scholar
74.Torng, C.J., Sivertsen, J.M., Judy, J.H., and Chang, C., J. Mater. Res. 5 (1990) p. 2490.CrossRefGoogle Scholar
75.Tsai, H.C., Bogy, D.B., Kundmann, M.K., Veirs, D.K., Hilton, M.R., and Mayer, S.T., J. Vac. Sci. Technol. 6 (1988) p. 2307.CrossRefGoogle Scholar
76.Marchon, B., Salmeron, M., and Siekhaus, W., Phys. Rev. B 39 (1989) p. 12907.CrossRefGoogle Scholar
77.Jansen, F., Machonkin, M.A., Kaplan, S., and Hark, S., J. Vac. Sci. Technol. 3 (1985) p. 605.CrossRefGoogle Scholar
78.Beeman, D., Lunds, R., and Anderson, M.R., Phys. Rev. B 30 (1984) p. 870.CrossRefGoogle Scholar
79.Lee, J.K., Smallen, M., Enguero, J., Lee, H.J., and Chao, A., IEEE Trans. Magn. 29 (1993) p. 276.CrossRefGoogle Scholar
80.Rabinowicz, E., Friction and Wear of Materials (John Wiley & Sons, Inc., New York, 1965) p. 168.Google Scholar
81.Savvides, N. and Window, B., J. Vac. Sci. Technol. 3 (1985) p. 2386.CrossRefGoogle Scholar
82.White, R.L., Doerner, M.F., and Walker, G.G., in Thin Films: Stresses and Mechanical Properties II, edited by Doerner, M., Oliver, W.C., Pharr, G.M., and Brotzen, F.R. (Mater. Res. Soc. Symp. Proc. 188, Pittsburgh, 1990) p. 213.Google Scholar
83.Marchon, B., Heiman, N., and Khan, M.R., IEEE Trans. Magn. 26 (1990) p. 168.CrossRefGoogle Scholar
84.Pan, X. and White, R.L. (unpublished research).Google Scholar
85.Agarwal, S., Li, E., and Heiman, N., IEEE Trans. Magn. 29 (1993) p. 264.CrossRefGoogle Scholar
86.Klaus, E. and Bhushan, B., Tribology and Mechanics of Magnetic Storage Systems, STLE SP-I9 (1985) p. 7.Google Scholar
87.Mate, C.M., Phys. Rev. Lett. 68 (1992) p. 3323.CrossRefGoogle Scholar
88.Wang, R.H., White, R.L., Meeks, S.W., and Byung, G.M., Proc. 1996 IEEE Intermag in press.Google Scholar
89.Velu, E.M.T. and Lambeth, D.N., IEEE Trans. Magn. 28 (1992) p. 3249.CrossRefGoogle Scholar
90.Sui, X., Singh, A., Chen, Y., Lambeth, D.N., and Kryder, M.H., IEEE Trans. Magn. 31 (1995) p. 2776.Google Scholar
91.Coffey, K.R., Parker, M.A., and Howard, J.K., IEEE Trans. Magn. 31 (1995) p. 2737.CrossRefGoogle Scholar