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Integrated MEMS Technologies

Published online by Cambridge University Press:  31 January 2011

Andrea E. Franke ,
Tsu-Jae King  and
Roger T. Howe
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Extract

While microelectromechanical systems (MEMS) technology has made a substantial impact over the past decade at the device or component level, it has yet to realize the “S” in its acronym, as complex microsystems consisting of sensors and actuators integrated with sense, control, and signal-processing electronics are still beyond the current state of the art. There are several incentives to co-fabricate MEMS devices and electronics on a single silicon chip, which apply to applications such as inertial sensors.

Type
Research Article
Information
MRS Bulletin , Volume 26 , Issue 4: Microelectromechanical Systems (MEMS): Technology and Applications , April 2001 , pp. 291 - 295
Copyright
Copyright © Materials Research Society 2001

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References

1Smith, J.H.Montague, S.Sniegowski, J.J.Murray, J.R. and McWhorter, P.J. “Embedded Mi-cromechanical Devices for the Monolithic Integration of MEMS with CMOS,” Proc. IEDM 1995 (Institute of Electrical and Electronics Engineers, Piscataway, NJ, 1995) p.609.Google Scholar
2Kung, J.T. U.S. Patent No.5,504,026 (April 2, 1996).Google Scholar
3Nathanson, H.C.Newell, W.E.Wickstrom, R.A. and Davis, J.R. Jr., IEEE Trans. Electron Devices ED-14 (1967) p.117.Google Scholar
4Howe, R.T. and Muller, R.S. “Integrated Resonant-Microbridge Vapor Sensor,” Proc. IEEE IEDM 1984 (Institute of Electrical and Electronics Engineers, Piscataway, NJ, 1984) p.213.Google Scholar
5Core, T.A.Tsang, W.K. and Sherman, S.J.Solid State Technol. 36 (10) (1993) p.39.Google Scholar
6Offenberg, M.Lamer, F.Elsner, B.Munzel, H. and Riethmuller, W. in Tech. Digest 8th Int. Conf. on Solid-State Sensors and Actuators/Eurosensors IX, Vol. 1 (Institute of Electrical and Electronics Engineers, Piscataway, NJ, 1995) p.589.Google Scholar
7Brosnihan, T.J.Bustillo, J.M.Pisano, A.P. and Howe, R.T. “Embedded Interconnect and Electrical Isolation for High-Aspect-Ratio, SOI Inertial Instruments,” Tech. Digest 1997 Int. Conf. on Solid-State Sensors and Actuators (Transducers '97), Vol.1 (1997) p.637.Google Scholar
8Parameswaran, L.Hsu, C. and Schmidt, M.A. “A Merged MEMS-CMOS Process Using Silicon Wafer Bonding,” Proc. IEDM 1995 (Institute of Electrical and Electronics Engineers, Piscataway, NJ) p.613.Google Scholar
9Baltes, H. and Brand, O.IEEE AES Sys. Mag. 14 (1999) p.29.CrossRefGoogle Scholar
10Xie, H.Erdmann, L.Zhu, X.Gabriel, K. and Fedder, G. “Post-CMOS Processing for High-Aspect-Ratio Integrated Silicon Microstructures,” Proc. Solid-State Sensor and Actuator Workshop (Transducers Research Foundation, Cleveland, 2000) p.77.Google Scholar
11Shaw, K.A. and MacDonald, N.C. in Proc. IEEE 9th Int. Workshop on MEMS (Institute of Electrical and Electronics Engineers, Piscat-away, NJ, 1996) p.44.Google Scholar
12Kessel, P.F. Van, Hornbeck, L.J.Meier, R.E. and Douglass, M.R. in Proc. IEEE 86 (1998) p.1687.CrossRefGoogle Scholar
13Putty, M.W. and Najafi, K. “A Microma-chined Vibrating Ring Gyroscope,” Proc. Solid-State Sensor and Actuator Workshop (Transducers Research Foundation, Cleveland, 1994), p. 213.Google Scholar
14Rodgers, M.S. and Sniegowski, J.J. “5-Level Polysilicon Surface Micromachine Technology: Application to Complex Mechanical Systems,” Proc. Solid-State Sensor and Actuator Workshop (Transducers Research Foundation, Cleveland, 1998) p.144.Google Scholar
15Sedky, S.Fiorini, P.Caymax, M.Loreti, S.Baert, K.Hermans, L. and Mertens, R.IEEE/ASME J.MEMS 7 (1998) p.365.CrossRefGoogle Scholar
16Li, B.Xiong, B.Jiang, L.Zohar, Y. and Wong, M.IEEE/ASME J.MEMS 8 (1999) p.366.Google Scholar
17Franke, A.E.Bilic, D.Chang, D.T.Jones, P.T.King, T.J.Howe, R.T. and Johnson, G.C.Tech. Digest IEEE Int. MEMS '99 Conference (Institute of Electrical and Electronics Engineers, Piscat-away, NJ, 1999) p.630.Google Scholar
18Franke, A.E.Jiao, Y.Wu, M.T.King, T.J. and Howe, R.T. “Post-CMOS Modular Integration of Poly-SiGe Microstructures Using Poly-Ge Sacrificial Layers,” Proc. Solid-State Sensor and Actuator Workshop (Transducers Research Foundation, Cleveland, 2000) p.18.Google Scholar
19Heck, J.M.Keller, C.G.Franke, A.E.Muller, L.King, T.J. and Howe, R.T. in Proc. 10th Int. Conf. on Solid-State Sensors and Actuators (Transducers '99), Vol. 1 (Institute of Electrical Engineers of Japan, Sendai, 1999) p. 328.Google Scholar