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Integrated MEMS Technologies

  • Andrea E. Franke, Tsu-Jae King and Roger T. Howe

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While microelectromechanical systems (MEMS) technology has made a substantial impact over the past decade at the device or component level, it has yet to realize the “S” in its acronym, as complex microsystems consisting of sensors and actuators integrated with sense, control, and signal-processing electronics are still beyond the current state of the art. There are several incentives to co-fabricate MEMS devices and electronics on a single silicon chip, which apply to applications such as inertial sensors.

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1Smith, J.H.Montague, S.Sniegowski, J.J.Murray, J.R. and McWhorter, P.J. “Embedded Mi-cromechanical Devices for the Monolithic Integration of MEMS with CMOS,” Proc. IEDM 1995 (Institute of Electrical and Electronics Engineers, Piscataway, NJ, 1995) p.609.
2Kung, J.T. U.S. Patent No.5,504,026 (April 2, 1996).
3Nathanson, H.C.Newell, W.E.Wickstrom, R.A. and Davis, J.R. Jr., IEEE Trans. Electron Devices ED-14 (1967) p.117.
4Howe, R.T. and Muller, R.S. “Integrated Resonant-Microbridge Vapor Sensor,” Proc. IEEE IEDM 1984 (Institute of Electrical and Electronics Engineers, Piscataway, NJ, 1984) p.213.
5Core, T.A.Tsang, W.K. and Sherman, S.J.Solid State Technol. 36 (10) (1993) p.39.
6Offenberg, M.Lamer, F.Elsner, B.Munzel, H. and Riethmuller, W. in Tech. Digest 8th Int. Conf. on Solid-State Sensors and Actuators/Eurosensors IX, Vol. 1 (Institute of Electrical and Electronics Engineers, Piscataway, NJ, 1995) p.589.
7Brosnihan, T.J.Bustillo, J.M.Pisano, A.P. and Howe, R.T. “Embedded Interconnect and Electrical Isolation for High-Aspect-Ratio, SOI Inertial Instruments,” Tech. Digest 1997 Int. Conf. on Solid-State Sensors and Actuators (Transducers '97), Vol.1 (1997) p.637.
8Parameswaran, L.Hsu, C. and Schmidt, M.A. “A Merged MEMS-CMOS Process Using Silicon Wafer Bonding,” Proc. IEDM 1995 (Institute of Electrical and Electronics Engineers, Piscataway, NJ) p.613.
9Baltes, H. and Brand, O.IEEE AES Sys. Mag. 14 (1999) p.29.
10Xie, H.Erdmann, L.Zhu, X.Gabriel, K. and Fedder, G. “Post-CMOS Processing for High-Aspect-Ratio Integrated Silicon Microstructures,” Proc. Solid-State Sensor and Actuator Workshop (Transducers Research Foundation, Cleveland, 2000) p.77.
11Shaw, K.A. and MacDonald, N.C. in Proc. IEEE 9th Int. Workshop on MEMS (Institute of Electrical and Electronics Engineers, Piscat-away, NJ, 1996) p.44.
12Kessel, P.F. Van, Hornbeck, L.J.Meier, R.E. and Douglass, M.R. in Proc. IEEE 86 (1998) p.1687.
13Putty, M.W. and Najafi, K. “A Microma-chined Vibrating Ring Gyroscope,” Proc. Solid-State Sensor and Actuator Workshop (Transducers Research Foundation, Cleveland, 1994), p. 213.
14Rodgers, M.S. and Sniegowski, J.J. “5-Level Polysilicon Surface Micromachine Technology: Application to Complex Mechanical Systems,” Proc. Solid-State Sensor and Actuator Workshop (Transducers Research Foundation, Cleveland, 1998) p.144.
15Sedky, S.Fiorini, P.Caymax, M.Loreti, S.Baert, K.Hermans, L. and Mertens, R.IEEE/ASME J.MEMS 7 (1998) p.365.
16Li, B.Xiong, B.Jiang, L.Zohar, Y. and Wong, M.IEEE/ASME J.MEMS 8 (1999) p.366.
17Franke, A.E.Bilic, D.Chang, D.T.Jones, P.T.King, T.J.Howe, R.T. and Johnson, G.C.Tech. Digest IEEE Int. MEMS '99 Conference (Institute of Electrical and Electronics Engineers, Piscat-away, NJ, 1999) p.630.
18Franke, A.E.Jiao, Y.Wu, M.T.King, T.J. and Howe, R.T. “Post-CMOS Modular Integration of Poly-SiGe Microstructures Using Poly-Ge Sacrificial Layers,” Proc. Solid-State Sensor and Actuator Workshop (Transducers Research Foundation, Cleveland, 2000) p.18.
19Heck, J.M.Keller, C.G.Franke, A.E.Muller, L.King, T.J. and Howe, R.T. in Proc. 10th Int. Conf. on Solid-State Sensors and Actuators (Transducers '99), Vol. 1 (Institute of Electrical Engineers of Japan, Sendai, 1999) p. 328.

Integrated MEMS Technologies

  • Andrea E. Franke, Tsu-Jae King and Roger T. Howe

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