Hostname: page-component-8448b6f56d-xtgtn Total loading time: 0 Render date: 2024-04-19T06:49:02.137Z Has data issue: false hasContentIssue false

TCAD simulation of a single Monolithic Active Pixel Sensors based on High Voltage CMOS technology

Published online by Cambridge University Press:  02 May 2018

Tuan A. Bui*
Affiliation:
School of Engineering, RMIT University, Melbourne, VIC3000, Australia
Geoffrey K. Reeves
Affiliation:
School of Engineering, RMIT University, Melbourne, VIC3000, Australia
Patrick W. Leech
Affiliation:
School of Engineering, RMIT University, Melbourne, VIC3000, Australia
Anthony S. Holland
Affiliation:
School of Engineering, RMIT University, Melbourne, VIC3000, Australia
Geoffrey Taylor
Affiliation:
School of Physics, The University of Melbourne, Melbourne, VIC3010, Australia
Get access

Abstract

A model of a High Voltage CMOS (HV-CMOS) Monolithic Active Pixel Sensor (MAPS) has been modelled using Technology Computer Aided Design (TCAD). The model has incorporated both the active region and the on-pixel readout circuits which were comprised of a source follower amplifier and an integrated charge amplifier. The simulation has examined the electrical characteristics and response output of a HV-CMOS MAPS sensor using typical dimensions, levels of doping in the structural layers and bias conditions for this sensor. The performance of two alternate designs of amplifier have been examined as a function of the operating parameters. The response of the sensor to the incidence of Minimum Ionizing Particles (MIPs) at different energies has been included in the model.

Type
Articles
Copyright
Copyright © Materials Research Society 2018 

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

Perić, I., Nucl. Instrum. Methods Phys.Res. A, 582, 876 (2007).CrossRefGoogle Scholar
Liang, Z., Affolder, A., Arndt, K., Bates, R., Benoit, M., Di Bello, F., Blue, A., Bortoletto, D., Buckland, M., Buttar, C., Caragiulo, P., Nucl. Instrum. Methods Phys. Res. A, 831, 156 (2016).CrossRefGoogle Scholar
Perić, I., Casanova Blanco, R., Mohr, R.C., Ehrler, F., Pixel 2016 Int. Workshop, Genova, Italy, (2016).Google Scholar
Fadeyev, V., Galloway, Z., Grabas, H., Grillo, A.A., Nucl. Instrum. Methods Phys. Res. A, 831, 189 (2016).CrossRefGoogle Scholar
Augustin, H., Berger, N., Dittmeier, S., Grzesik, C., Nucl. Instrum. Methods Phys. Res. A, 845, 194 (2017).CrossRefGoogle Scholar
Sentaurus, T., J2014–09 Sentaurus Device Manual, ed: Synopsys, Inc., Mountain View, CA, USA, (2014).Google Scholar
Masetti, G., Severi, M., and Solmi, S., IEEE Transactions on electron devices, 30 (1983) 764769.CrossRefGoogle Scholar
Canali, C., Majni, G., Minder, R., and Ottaviani, G., IEEE Transactions on Electron Devices, 22 (1975) 10451047.CrossRefGoogle Scholar
Lundstrom, M. S. and Schuelke, R. J., IEEE Transactions on Electron Devices, 30 (1983) 11511159.CrossRefGoogle Scholar