Hostname: page-component-8448b6f56d-jr42d Total loading time: 0 Render date: 2024-04-24T23:54:25.163Z Has data issue: false hasContentIssue false
  • English
  • Français

Modeling of Plasma Expansion during Pulsed Electron Beam Ablation of Graphite

Published online by Cambridge University Press:  23 January 2017

Muddassir Ali  and
Redhouane Henda
Muddassir Ali*
Affiliation:
Bharti School of Engineering, Laurentian University, 935 Ramsey Lake Road, Sudbury, ON P3E 2C6, Canada.
Redhouane Henda
Affiliation:
Bharti School of Engineering, Laurentian University, 935 Ramsey Lake Road, Sudbury, ON P3E 2C6, Canada.
*
*(Email: mx1_ali@laurentian.ca)

Abstract

Core share and HTML view are not available for this content. However, as you have access to this content, a full PDF is available via the ‘Save PDF’ action button.

Pulsed electron beam ablation (PEBA) has proven to be a promising and powerful technique for the growth of high quality thin films. Pulsed electron beam film deposition consists of many physical processes including target material heating, target ablation, plasma plume expansion, and film growth on a substrate. Plasma plume expansion into a vacuum or an ambient gas is a fundamental issue in PEBA as the quality of thin films deposited onto the substrate depends on the composition, energy and density of particles ejected from the target. In the present study, gas-dynamics equations are solved to investigate plasma expansion induced by interaction of a nanosecond electron beam pulse (∼100 ns) with a graphite target in an argon atmosphere at reduced pressure. The spatio-temporal profiles of the temperature, pressure, velocity, and density of the plasma plume are numerically simulated for a beam efficiency of 0.6 and accelerating voltage of 15 kV. The preliminary results show a rich variety of behaviors. The model is validated by comparing some of the obtained simulation results with experimental data available in the literature.

Keywords

electron irradiationplasma depositionthin film
Type
Articles
Information
MRS Advances , Volume 2 , Issue 16: Processing and Manufacturing , 2017 , pp. 905 - 911
Copyright
Copyright © Materials Research Society 2017 

References

REFERENCES

Gilgenbach, R.M., Kovaleski, S.D., Lash, J.S., Ang, L.K. and Lau, Y.Y., IEEE Trans. Plasma Sci. 27, 150–158 (1999).Google Scholar
Müller, G., Konijnenberg, M., Kraff, G. and Schultheiss, C., in Science and Technology of Thin Films, edited by Matacotta, F.C. and Ottaviani, G. (World Scientific, Singapore, 1995), pp. 89–119.CrossRefGoogle Scholar
Kovaleski, S.D., Gilgenbach, R.M., Ang, L.K., Lau, Y.Y. and Lash, J.S., Appl. Surf. Sci. 127 -129, 947–952 (1998).Google Scholar
Misra, A., Mitra, A. and Thareja, R.K., Appl. Phys. Lett. 74, 929–931 (1999).CrossRefGoogle Scholar
Thareja, R.K., Dwivedi, R.K. and Abhilasha, , Phys. Rev. B 55, 2600–2605 (1999).Google Scholar
Strikovski, M. and Harshavardhan, K.S., Appl. Phys. Lett. 82, 853–855 (2003).CrossRefGoogle Scholar
Ali, M. and Henda, R., ECS J. Solid State Sci. Technol. 4, P369–P375 (2015).Google Scholar
Faghri, A., and Zhang, Y., Transport Phenomena in Multiphase Systems, 1st ed. (Academic Press, Burlington, 2006).Google Scholar
Bird, R.B., Stewart, W.E. and Lightfoot, E.N., Transport Phenomena, 2nd ed. (John Wiley and Sons Inc., New York, 2002).Google Scholar
Cristoforetti, G., Giacomo, A.D., Dell’Aglio, M., Legnaioli, S., Tognoni, E., Palleschi, V., and Omenetto, N., Spectrochimica Acta Part B: Atomic Spectroscopy 65, 86–95 (2010).Google Scholar
Zel’dovich, Y.B. and Raizer, Y.P., Physics of Shock Waves and High-Temperature Hydrodynamic Phenomena, vol. 1 (Academic Press Inc., New York, 1966).Google Scholar
Knight, C. J., AIAA J., 17, 519–523 (1979).Google Scholar
Chen, Z. and Bogaerts, A.. J. Appl. Phys. 97, 063305 (2005).Google Scholar
Ali, M. and Henda, R., Appl. Surf. Sci. 396, 67–77 (2017).Google Scholar
Witke, T., Lenk, A. and Schultrich, B., IEEE Trans. Plasma Sci. 24, 61–62 (1996).Google Scholar
Tricot, S., Leborgne, C.B., Nistor, M., Millon, E. and Perrière, J., J. Phys. D: Appl. Phys. 41, 175205 (2008).CrossRefGoogle Scholar
Nistor, M., Gherendi, F. and Mandache, N.B., IEEE Trans. Plasma Sci. 39, 2800–2801 (2011).Google Scholar