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Low Temperature Soldering Surface-Mount Electronic Components with Hydrogen Assisted Copper Electroplating

Published online by Cambridge University Press:  02 January 2018

Sabrina M. Rosa-Ortiz ,
Kishore Kumar Kadari  and
Arash Takshi
Sabrina M. Rosa-Ortiz
Affiliation:
Department of Electrical Engineering, University of South Florida, Tampa, FL33620, U.S.A.
Kishore Kumar Kadari
Affiliation:
Department of Electrical Engineering, University of South Florida, Tampa, FL33620, U.S.A.
Arash Takshi*
Affiliation:
Department of Electrical Engineering, University of South Florida, Tampa, FL33620, U.S.A.
*
*(Email: atakshi@usf.edu)
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Abstract

Copper growth for the development of electroplating technique as a low-temperature soldering procedure represents a useful method for the formation of metal deposits, allowing modification of the thickness and morphology of the soldering joints. The approach is particularly useful for soldering electronic components to a plastic 3D printed substrate. To accelerate the soldering process hydrogen assisted electroplating (HAE) method was employed at room temperature. The experiments were designed by making a small electrochemical cell around the gap on a printed circuit board (PCB) or a 3D printed conductive track. During the experiment, water electrolysis was observed, which released hydrogen bubbles. The hydrogen bubbles caused the structure of the electroplated layer to be more porous, but with a similar conductivity as solid copper and a remarkable mechanical strength suitable for use as interconnects on an electronic circuit. Our electrochemical data and video recorded images show a fast and reliable copper electrodeposition in less than 1 minute. The morphology of copper deposits on a 3D printed structure was studied with the scanning electron microscopy (SEM). A reliable soldering process was demonstrated for a surface mount light emitting diode (LED) on a PCB. Further experiments are required to optimize the soldering process for faster and more reliable electroplating, particularly for 3D printed substrates.

Keywords

electrodepositionscanning electron microscopy (SEM)devices
Type
Articles
Information
MRS Advances , Volume 3 , Issue 18: Processing and Manufacturing , 2018 , pp. 963 - 968
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Copyright
Copyright © Materials Research Society 2017 

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