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Highly Conductive Polymer Nanocomposite – Application in Interconnects and Traces

  • Chenggang Chen (a1) (a2), Sabyasachi Ganguli (a1), Ajit K. Roy (a1) and Jason Foley (a3)

Abstract

Commercial off-the-shelf (COTS) electronics are generally not specifically designed to perform in extremely transient high impact scenarios. This research focused on the development of a silver-decorated carbon black-based polymeric nanocomposite with properties such as high conductivity, flexibility, and shock absorbency. Polymeric rubber materials are generally very flexible and shock absorbing, however, most polymeric materials are electrical insulators. The dispersion of the silver-decorated carbon black into the polymeric matrix could significantly improve the electrical conductivity. The processing and fabrication of Ag-CB (silver-carbon black)/Epoxy (thermosetting epoxy polymer) and Ag-CB/TPU (thermoplastic polyurethane) will be reported. Both Ag-CB/Epoxy and Ag-CB/TPU mixtures with solvents showed the shear-thinning behavior, which was an important characteristic for direct printing of traces and Additive Manufacturing (AM). The mechanical properties of the nanocomposites were measured using Dynamic Mechanical Analysis (DMA) over a wide range of temperatures. These nanocomposite materials were also successfully used to print flexible circuits using a 3D-printing machine. The electrical resistance change for the Ag-CB/Epoxy on polydimethylsiloxane (PDMS) and Ag-CB/TPU on PDMS under strain was studied, and the results will be discussed.

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References

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Keywords

Highly Conductive Polymer Nanocomposite – Application in Interconnects and Traces

  • Chenggang Chen (a1) (a2), Sabyasachi Ganguli (a1), Ajit K. Roy (a1) and Jason Foley (a3)

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