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Electrical Characterization of Traditional and Aerosol Jet Printed Conductors Under Tensile Strain

Published online by Cambridge University Press:  11 January 2016

Jake Rabinowitz
Affiliation:
– C. S. Draper Laboratory, Cambridge MA – Northeastern University Dpt. Chemical Engineering, Boston MA
Gregory Fritz
Affiliation:
– C. S. Draper Laboratory, Cambridge MA
Parshant Kumar
Affiliation:
– C. S. Draper Laboratory, Cambridge MA
Peter Lewis
Affiliation:
– C. S. Draper Laboratory, Cambridge MA
Mikel Miller
Affiliation:
– C. S. Draper Laboratory, Cambridge MA
Andrew Dineen
Affiliation:
– C. S. Draper Laboratory, Cambridge MA
Caprice Gray*
Affiliation:
– C. S. Draper Laboratory, Cambridge MA
*
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Abstract

In this work, we propose a model to quantify strain induced conductor discontinuities based on measuring electrical resistance while applying tensile strain to metal-polymer systems. Under strain, changing conductor geometry and induced conductor discontinuity increase electrical resistance. On Kapton substrates strained to ε = .07, evaporated gold films did not deform and resistance increase was only caused by geometry change. Conversely, discontinuity caused 31% and 72% of the resistance increase in evaporated and printed silver films at the same strain. On PDMS substrates, the same magnitude of discontinuity, causing 31% of the resistance increase, occurred at only ε = .024 in evaporated silver films. At the same strain, discontinuity caused 86% of the resistance increase in evaporated gold films. Printed silver films were inelastic. The results suggest that traditional fabrication techniques may be more suitable to flexible hybrid electronics applications than additively manufactured conductors.

Type
Articles
Copyright
Copyright © Materials Research Society 2016 

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References

REFERENCES

Vaezi, M., Seitz, H., Yang, S., Int. J. Adv. Manuf. Tech. 67, 1721 (2013).Google Scholar
Adams, J. J., Slimmer, S. C., Lewis, J. A., Bernhard, J. T., Electron. Lett. 51, 661 (2015).Google Scholar
Chung, S., Lee, J., Song, H., Kim, S., Jeong, J., Hong, Y., Appl. Phys. Lett. 98, 153110 (2011).Google Scholar
Lu, N., Wang, X., Suo, Z., Vlassak, J., Appl. Phys. Lett. 91, 221909 (2007).CrossRefGoogle Scholar
Graz, I. M., Cotton, D. P. J., Lacour, S. P., App. Phys. Lett. 94, 071902 (2009).Google Scholar
Li, T., Huang, Z., Suo, Z., Lacour, S. P., Wagner, S., Appl. Phys. Lett. 85, 3435 (2004).Google Scholar
Xu, F., Zhu, Y., Adv. Mater. 24, 5117 (2012).CrossRefGoogle Scholar
Walker, S. B., Lewis, J. A., Am, J.. Chem. Soc. 134, 1419 (2012).CrossRefGoogle Scholar
Cairns, D. R., Witte, R. P., Sparacin, D. K., Sachsman, S. M., Paine, D. C., Crawford, G. P., Appl. Phys. Lett. 76, 1425 (2000).CrossRefGoogle Scholar
Kim, Y., Ren, X., Kim, J. W., Noh, H., J. Micromech. Microeng. 24, 115010 (2014).CrossRefGoogle Scholar
Khang, DY, Rogers, J. A., Lee, H. H., Adv. Funct. Mater. 19, 1526 (2009).Google Scholar