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Preparing TEM Specimens and Atom Probe Tips by Laser Machining

  • Boris Rottwinkel (a1), André Kreutzer (a1), Henry Spott (a1), Michael Krause (a2), Georg Schusser (a2) and Thomas Höche (a2)...

Abstract

Preparation of electron-transparent thin specimens can be costly in terms of time and is often challenging. Materials and products are becoming more complex, and device components are getting smaller each year. On the other hand, analysis and diagnostic methods become more exacting. Lack of time and high costs for diagnostics force companies to speed up, simplify, and customize the analysis process. Ultra-short-pulsed laser-based sample preparation can speed up the process and make possible new sample geometries. This article shows the advantages of this technology and how it can be used to prepare TEM lamellas (H-Bar) and multiple APT tips or pillars.

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References

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[1]Sato, T and Byrnes, J, “TEM sample preparation workflow using laser ablation and broad ion beam milling,” 19th International Microscopy Congress (IMC19), poster.
[2]Byrnes, J et al. , “A combined laser ablation/focused ion beam approach to atom probe sample preparation,” 19th International Microscopy Congress (IMC19), poster.
[3]Schmidt, “Nanoscale 3D X-ray Microscopy for High Density Multi-Chip Packaging FA” 44 th International Symposium for Testing and Failure Analysis (ISTFA2018) (2018) 424–28.
[4]Höche, Th, PCT Patent Application WO 2013/026707 A1.
[5]Krause, M and Höche, Th, EP Patent Application EP 13 16 2360.
[6]Höche, Th et al. , “Femto-second-Laser Interaction with Mo/Si Multilayer Stack at Low Fluence ,” Appl Phys A 79(4–6) (2004) 961–63.10.1007/s00339-004-2583-4
[7]Höche, Th et al. , “Nanostructural Investigations on Ripples Prepared by Femto-Second Laser Treatment of Silicon,” Proc. 2nd International Congress on Applications of Lasers & Electro Optics (ICALEO), Jacksonville, FL, October 2003.
[8]Ruthe, D et al. , “Etching of CuInSe2 Thin Films - Comparison of Femtosecond and Picosecond Laser Ablation ,” Appl Surf Sci 247 (2005) 447–52.
[9]Martens, S et al. , “Simulation-Based Analysis of the Heat-Affected Zone during Target Preparation by Pulsed-Laser Ablation through Stacked Silicon Dies in 3D Integrated System-in-Packages,” 11th Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE, 2010.

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Preparing TEM Specimens and Atom Probe Tips by Laser Machining

  • Boris Rottwinkel (a1), André Kreutzer (a1), Henry Spott (a1), Michael Krause (a2), Georg Schusser (a2) and Thomas Höche (a2)...

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