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Future Prospects for Defect and Strain Analysis in the SEM via Electron Channeling

  • Yoosuf N. Picard (a1), Ranga Kamaladasa (a1), Marc De Graef (a1), Noel T. Nuhfer (a1), William J. Mershon (a2), Tony Owens (a2), Libor Sedlacek (a3) and Filip Lopour (a3)...

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Electron diffraction in both SEM and TEM provides a contrast mechanism for imaging defects as well as a means for quantifying elastic strain. Electron backscatter diffraction (EBSD) is the commercially established method for SEM-based diffraction analysis. In EBSD, Kikuchi patterns are acquired by a charge-coupled device (CCD) camera and indexed using commercial software. Phase and crystallographic orientation information can be extracted from these Kikuchi patterns, and researchers have developed cross-correlation methods to measure strain as well.

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Future Prospects for Defect and Strain Analysis in the SEM via Electron Channeling

  • Yoosuf N. Picard (a1), Ranga Kamaladasa (a1), Marc De Graef (a1), Noel T. Nuhfer (a1), William J. Mershon (a2), Tony Owens (a2), Libor Sedlacek (a3) and Filip Lopour (a3)...

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