Hostname: page-component-78c5997874-4rdpn Total loading time: 0 Render date: 2024-11-19T11:51:36.687Z Has data issue: false hasContentIssue false
  • English
  • Français

Structural Characterization of Cu10Mo Alloy Synthesized by Mechanical Alloying

Published online by Cambridge University Press:  01 August 2018

O. Hernández ,
C. Aguilar ,
A. Medina ,
L. Béjar ,
C. Parra ,
H. Carreón  and
S.E. Borjas-García
O. Hernández
Affiliation:
UMSNH. Ciudad Universitaria. Morelia, Michoacán. México 58000
C. Aguilar
Affiliation:
Departamento de Ingeniería Metalúrgica y Materiales, Universidad Técnica Federico Santa María, Av. España 1680, Valparaíso, Chile
A. Medina
Affiliation:
UMSNH. Ciudad Universitaria. Morelia, Michoacán. México 58000
L. Béjar
Affiliation:
UMSNH. Ciudad Universitaria. Morelia, Michoacán. México 58000
C. Parra
Affiliation:
Departamento de Física, Universidad Técnica Federico Santa María, Av. España 1680, Valparaíso, Chile
H. Carreón
Affiliation:
UMSNH. Ciudad Universitaria. Morelia, Michoacán. México 58000
S.E. Borjas-García
Affiliation:
UMSNH. Ciudad Universitaria. Morelia, Michoacán. México 58000

Abstract

An abstract is not available for this content so a preview has been provided. As you have access to this content, a full PDF is available via the ‘Save PDF’ action button.
Image of the first page of this content. For PDF version, please use the ‘Save PDF’ preceeding this image.'
Type
Abstract
Information
Microscopy and Microanalysis , Volume 24 , Supplement S1: Proceedings of Microscopy & Microanalysis 2018 , August 2018 , pp. 800 - 801
Copyright
© Microscopy Society of America 2018 

References

[1] Davis, J. R Copper and copper alloys. ASM international ((Ed.) 2001.Google Scholar
[2] Zhao, Q., et al, Powder Technology 321 2017) p. 326–335.Google Scholar
[3] Ghorbani, A. Sheibani, S Journal of Alloys and Compounds 732 2018) p. 818–827.Google Scholar
[4] Chen, X., et al, High Pressure 2017) p. 1–12.Google Scholar
[5] Hamlati, Z., et al, Journal of Nano Research 47 2007) p. 79–88.Google Scholar
[6] Lutterotti, L., Matthies, S. Wenk, H.-R. MAUD: a friendly Java program for material analysis using diffraction. IUCr: Newsletter of the CPD 21, 14–15, 1999.Google Scholar