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Site-Specific TEM Specimen Preparation of Samples with Sub-Surface Features

Published online by Cambridge University Press:  23 September 2015

Julia I. Deitz
Affiliation:
Dept. of Materials Science & Engineering, The Ohio State University, Columbus, OH, 43210, USA
Santino D. Carnevale
Affiliation:
Dept. of Electrical & Computer Engineering, The Ohio State University, Columbus, OH, 43210, USA
David W. McComb
Affiliation:
Dept. of Materials Science & Engineering, The Ohio State University, Columbus, OH, 43210, USA Institute for Materials Research, The Ohio State University, Columbus, OH, 43210, USA
Steven A. Ringel
Affiliation:
Dept. of Electrical & Computer Engineering, The Ohio State University, Columbus, OH, 43210, USA Institute for Materials Research, The Ohio State University, Columbus, OH, 43210, USA
Tyler J. Grassman
Affiliation:
Dept. of Materials Science & Engineering, The Ohio State University, Columbus, OH, 43210, USA Dept. of Electrical & Computer Engineering, The Ohio State University, Columbus, OH, 43210, USA

Abstract

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Type
Abstract
Copyright
Copyright © Microscopy Society of America 2015 

References

References:

[1] Carnevale, S., Deitz, J., Grassman, T., Carlin, J., Picard, Y., De Graef, M. & Ringel, S., "Rapid misfit dislocation characterization in heteroepitaxial III-V/Si thin films by electron channeling contrast imaging. Applied Physics Letters 104(23), 232111 (2014).CrossRefGoogle Scholar
[2] Carnevale, S., Deitz, J., Grassman, T., Carlin, J., Picard, Y., De Graef, M. & Ringel, S., "Applications of Electron Channeling Contrast Imaging for the Rapid Characterization of Extended Defects in III-V/Si Heterostructures. IEEE Journal of Photovoltaics, accepted (2014). Early Access: <underline>http://dx.doi.org/10.1109/JPHOTOV.2014.2379111</underline>..Google Scholar