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Semiconductor and Soft Material Analysis with Low-kV TEM

Published online by Cambridge University Press:  05 August 2019

Toshie Yaguchi
Affiliation:
Electron Microscope System Design 2nd Dept., Hitachi High-Technologies Corporation, Ibaraki, JAPAN.
Keiji Tamura
Affiliation:
Electron Microscope System Design 2nd Dept., Hitachi High-Technologies Corporation, Ibaraki, JAPAN.
Takashi Kubo
Affiliation:
Electron Microscope System Design 2nd Dept., Hitachi High-Technologies Corporation, Ibaraki, JAPAN.
Yasuyuki Nodera
Affiliation:
Electron Microscope Solution Systems Design Dept., Hitachi High-Technologies Corporation, Ibaraki, JAPAN.
Keisuke Igarashi
Affiliation:
Application Development Dept., Hitachi High-Technologies Corporation, Ibaraki, JAPAN.
Akiko Wakui
Affiliation:
Application Development Dept., Hitachi High-Technologies Corporation, Ibaraki, JAPAN.
Takashi Kanemura
Affiliation:
Application Development Dept., Hitachi High-Technologies Corporation, Ibaraki, JAPAN.
Mami Konomi
Affiliation:
Application Development Dept., Hitachi High-Technologies Corporation, Ibaraki, JAPAN.
Corresponding
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Abstract

Image of the first page of this article
Type
Low Voltage, Low Energy Electron Microscopy Imaging and Analysis
Copyright
Copyright © Microscopy Society of America 2019 

References

[1]Tamura, K., et al. , Microsc.Microanal. 24 (Suppl 1), 2018, 1156-1157.CrossRefGoogle Scholar
[2]Nagaoki, I., et al. , THE HITACHI SCIENTIFIC INSTRUMENT NEWS 60 (2), 2017, 5291-5294.Google Scholar
[3]Kamino, T., et al. , Microsc. Microanal. 23, 2017, 945950.CrossRefGoogle Scholar

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