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Microstructure Evolution with Direct Current Density on Electrodeposited Copper Films

Published online by Cambridge University Press:  31 July 2015

R. F. Santos ,
F. Viana  and
P.J. Ferreira
R. F. Santos
Affiliation:
CEMUC, Department of Metallurgical and Materials Engineering, University of Porto, R. Dr. Roberto Frias, 4200-465 Porto, Portugal Materials Science and Engineering Program, University of Texas at Austin, Austin, TX 78712, USA
F. Viana
Affiliation:
CEMUC, Department of Metallurgical and Materials Engineering, University of Porto, R. Dr. Roberto Frias, 4200-465 Porto, Portugal
P.J. Ferreira
Affiliation:
Materials Science and Engineering Program, University of Texas at Austin, Austin, TX 78712, USA
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Abstract

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Type
Materials Science
Information
Microscopy and Microanalysis , Volume 21 , Issue S5: INCOMAM'14 International Conference on Microscopy and Microanalysis , August 2015 , pp. 45 - 46
Copyright
© Microscopy Society of America 2015

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References

[1]Song, J.-M., et al., Mat Sci Eng A-Struct 559 (2013). p. 655–664.10.1016/j.msea.2012.09.006Google Scholar
[2]Niu, R. & Han, K., Scripta Mater 68 (2013). p. 960–963.10.1016/j.scriptamat.2013.02.051Google Scholar
[3]Alshwawreh, N., et al., Microelectron Eng 95 (2012). p. 26–33.10.1016/j.mee.2012.02.035Google Scholar
[4] To “Centro de Materiais da Universidade do Porto” in the person of Rui Rocha. This work was supported by “Fundação para a Ciência e a Tecnologia” (FCT) through the grant SFRH/BD/61827/2009 and sponsored by FEDER funds through the program COMPETE – “Programa Operacional Factores de Competitividade” – and by national funds through FCT under the project PEst-C/EME/UI0285/2011..Google Scholar